Used SMT Equipment | Chipshooters / Chip Mounters
JUKI FX-3 Pick and Place machine Specification Substrate dimension: L- substrate-(410×360mm) L-wide substrate-(510×360mm)*1 XL substrate-(610×560mm) Component Height:6mm size Component range : laser discrimination radar system,0402(British 01005) ~
Used SMT Equipment | Pick and Place/Feeders
JUKI FX-3 Pick and Place machine Specification Substrate dimension: L- substrate-(410×360mm) L-wide substrate-(510×360mm)*1 XL substrate-(610×560mm) Component Height:6mm size Component range : laser discrimination rada
Used SMT Equipment | SMT Equipment
JUKI KE-2070L Pick and Place Machine Specification Model :KE-2070L ■ Laser mount head * 1 (6 suction nozzle) ■ PCB Board Size： L (50*30-410*360mm) ■ Component height: 6mm ■ Component mount range: Laser Recognition: 0402(0100
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Used SMT Equipment | Pick and Place/Feeders
The NPM-TT2 (Next Production Modular-Twin Tray II) platform represents the next generation in twin tray modular production from Panasonic’s award-winning NPM platform—ideal for any mix. Further bolstering the SMT process to accommodate m
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Used SMT Equipment | Assembly Accessories
Panasonic's BM231 modular high speed multi-functional placement machine boasts any volume, any mix capability by placing a wide array of components from 0402 (01005) microchips to BGA's, CSP's and connectors. Outstanding productivity is a
Used SMT Equipment | Pick and Place/Feeders
Applicable PCB L510 x W460mm to L50 x W50mm Note: Available in lengths up to L610mm as an option Applicable components03015 to W55 x L100mm (For parts sizes larger the width 45mm, recognition of parts is divided into sections.), Height 15mm or
Used SMT Equipment | Pick and Place/Feeders
Samsung Samsung CP45FV-Neo advantages: 1, simple operation, flexible line change: Samsung's CP and SM series Mounter is recognized by the industry's most simple operation of the model, which uses WinXP system, compatible with Gerb files,
Used SMT Equipment | Pick and Place/Feeders
FEATURES ▶Higher productivity and quality with printing, placement and inspection process integration▶For larger boards and larger PCBs up to a size of 750 x 550 mm with component range up to L150 x W25 x T30 mm▶Higher area productivity through dual
Used SMT Equipment | Soldering - Reflow
The latest breakthroughs associated with the Mark 5 reflow system now provide you with an even lower cost-of-ownership. Heller's new heating and cooling advances deliver up to 40% reduction in nitrogen and electrical consumption. This makes the MK 5
Used SMT Equipment | Pick and Place/Feeders
JUKI Mounter fx-1r parameters: Board size: 410*360mm Component height: 6mm 33,000CPH：chip (optimal) / 25,000CPH: chip (IPC 9850) Two independent multi-nozzle laser heads (8 total nozzles) from 0603 （0201） to 20mm square components or 26.5×
