Used SMT Equipment: wafer aoi die inspect (Page 1 of 1)

ASM Siemens SIPLACE CA

Used SMT Equipment | Pick and Place/Feeders

Highlights of the SIPLACE CA: With the four SIPLACE SpeedStar heads for high-precision placements you can process up to 126,000 SMT components, 46,000 flip-chips, or 30,000 die-attach components per hour Component supplied from changeov

Qinyi Electronics Co.,Ltd

PARMI ZEUS-L

PARMI ZEUS-L

Used SMT Equipment | AOI / Automated Optical Inspection

3D Wafer Bump &Wire Bonding AOI Inspection system Highest quality 3D Wire-Inspection. With high-resolution, complete inspection is possible even for Foot-shape. Inspect Mirror-surface without Reflection problem. As for PEMTRON'S unique optical techn

INSPECTION TECH

MVP Ultra 850G Component AOI Autoi

MVP Ultra 850G Component AOI Autoi

Used SMT Equipment | AOI / Automated Optical Inspection

Single lane 3 position conveyor; 12" x 12" work area; 5MP camera; die bond and wire bond inspection.

GES Associates LLC

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