Used SMT Equipment: wafer die eject (Page 1 of 1)

Kulicke&Soffa Industries PIXALUX - Micro & Mini LED

Kulicke&Soffa Industries PIXALUX - Micro & Mini LED

Used SMT Equipment | Pick and Place/Feeders

K&S PIXALUX High Speed LED Placement Machine Model: PIXALUX Year: 2018 Micro & Mini LED Placement  High productivity and yield with its ultrafast placement head design Placement accuracy and speed on multiple types of substrates Supports placement o

Midwest SMT

Fuji Chip Mounter NXT-H

Fuji Chip Mounter NXT-H

Used SMT Equipment | Chipshooters / Chip Mounters

NXT-H and NXT-Hw support placing small LEDs and bare dies at high-speed as well as performing hybrid production including flip chips.Fuji Ultra Accurate Placement Platform.Hybrid placement of wafers and SMDs. Wafer and reel part placement in a single

QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd

Fuji Chip Mounter NXT-Hw

Fuji Chip Mounter NXT-Hw

Used SMT Equipment | Chipshooters / Chip Mounters

NXT-H and NXT-Hw support placing small LEDs and bare dies at high-speed as well as performing hybrid production including flip chips.Fuji Ultra Accurate Placement Platform.Hybrid placement of wafers and SMDs. Wafer and reel part placement in a single

QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd

ASM Siemens SIPLACE CA

Used SMT Equipment | Pick and Place/Feeders

Highlights of the SIPLACE CA: With the four SIPLACE SpeedStar heads for high-precision placements you can process up to 126,000 SMT components, 46,000 flip-chips, or 30,000 die-attach components per hour Component supplied from changeov

QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd

ASM Siemens MS899

ASM Siemens MS899

Used SMT Equipment | General Purpose Equipment

ASM MS899-DL Wafer Mapping Die Sorter Machine is in like new condition! Serial Number: MS899DL-01817-0402 Model Number: MS899-DL Year 2008 August Cycle Time: 175 ms XY Placement: +/- 1.5 mil Die Rotation: +/- 3 degrees Collect type: Surfa

1st Place Machinery Inc.

ASM Siemens SIPLACE CA

ASM Siemens SIPLACE CA

Used SMT Equipment | Pick and Place/Feeders

Make: ASMModel:ASM SIPLACE CA Details:1. High-Speed Placement CapabilitySMT component placement speed up to 76,000 components per hour (Cph).Flip chip placement from wafer up to 40,000 Cph.Die attach placement from wafer up to 50,000 Cph. 2. Placemen

Extension Electromechanical equipment HK Co.,Ltd

ASM Siemens SIPLACE CA

ASM Siemens SIPLACE CA

Used SMT Equipment | Pick and Place/Feeders

Make: ASMModel:ASM SIPLACE CA Details:1. High-Speed Placement CapabilitySMT component placement speed up to 76,000 components per hour (Cph).Flip chip placement from wafer up to 40,000 Cph.Die attach placement from wafer up to 50,000 Cph. 2. Placemen

Extension Electromechanical equipment HK Co.,Ltd

ASM Siemens SIPLACE CA

ASM Siemens SIPLACE CA

Used SMT Equipment | Pick and Place/Feeders

Make: ASMModel:ASM SIPLACE CA Details:1. High-Speed Placement CapabilitySMT component placement speed up to 76,000 components per hour (Cph).Flip chip placement from wafer up to 40,000 Cph.Die attach placement from wafer up to 50,000 Cph. 2. Placemen

Extension Electromechanical equipment HK Co.,Ltd

ASM Siemens SIPLACE CA

ASM Siemens SIPLACE CA

Used SMT Equipment | Pick and Place/Feeders

Make: ASMModel:ASM SIPLACE CA Details:1. High-Speed Placement CapabilitySMT component placement speed up to 76,000 components per hour (Cph).Flip chip placement from wafer up to 40,000 Cph.Die attach placement from wafer up to 50,000 Cph. 2. Placemen

Extension Electromechanical equipment HK Co.,Ltd

ASM Siemens SIPLACE CA

ASM Siemens SIPLACE CA

Used SMT Equipment | Pick and Place/Feeders

Make: ASMModel:ASM SIPLACE CA Details:1. High-Speed Placement CapabilitySMT component placement speed up to 76,000 components per hour (Cph).Flip chip placement from wafer up to 40,000 Cph.Die attach placement from wafer up to 50,000 Cph. 2. Placemen

Extension Electromechanical equipment HK Co.,Ltd

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