Industry News: wire bonding (Page 14 of 24)

PEMTRON's D2 Series AOI & SPI Wins a Mexico Technology Award

Industry News | 2024-09-16 18:52:11.0

PEMTRON is pleased to announce that its D2 (Dual Lane & Dual Head) Series AOI and SPI system has received a Mexico Technology Award in the category of Inspection Equipment – SPI Systems. The award was announced during a ceremony that took place on Wednesday, September 11, 2024 during SMTA Guadalajara in Mexico.

Pemtron

Nordson Test & Inspection Honored with Technology Award for SQ3000M2

Industry News | 2024-09-16 19:52:03.0

Nordson TEST & INSPECTION today announced that its latest innovation has earned a Mexico Technology Award. The SQ3000M2 Automated Optical Inspection (AOI) system won in the category of Inspection Equipment – AOI Systems. The award was announced during a recent ceremony at SMTA Guadalajara in Mexico, where the new system was first unveiled.

Nordson Corporation

Machine Vision Products Demonstrates 850G Solutions For Inspection Of Back-End Processes Including Lead-Frames, Wire-Bond, Die And Epoxy At Semicon Taiwan 2012

Industry News | 2012-08-31 12:32:09.0

Carlsbad, CA – September 1, 2012: Machine Vision Products today announced they would be demonstrating their 850G Inspection solutions at the Semicon Taiwan 2012 exhibition. The exhibition is at the Taipei World Trade Center, Nangang Hall in Taipei, Taiwan from September 5-7 2012. Machine Vision Products are exhibiting on Booth #960 with Sigmatek Corp.

Machine Vision Products, Inc

Vinatronic Purchases New Glenbrook X-Ray Inspection System

Industry News | 2021-01-21 18:51:54.0

Vinatronic has just upgraded its X-ray capabilities with a brand-new Glenbrook JewelBox 70T Real Time X-ray Inspection System.

Vinatronic

Semiconductor equipment billings increase in December

Industry News | 2021-01-28 01:09:48.0

Billings among North American manufacturers of semiconductor production equipment grew 2.6% sequentially and 7.6% on year in December 2020, according to SEMI.

Unicomp Technology Co., Ltd

Machine Vision Products Demonstrates Semiconductor and Microelectronics Capabilities of the Ultra 850G AOI at Semicon Taiwan 2009

Industry News | 2009-09-22 20:55:51.0

Carlsbad, CA – September 23rd, 2009: Machine Vision Products today announced it would be demonstrating the Ultra 850G Semiconductor, Packaging and MicroElectronics AOI solution at the Semicon Taiwan 2009. The exhibition is at the Taipei World Trade Center between September 30th and October 2nd and Machine Vision Products are located within booth #796.

Machine Vision Products, Inc

Machine Vision Products Demonstrates MicroElectronics and Packaging Capabilities of the Ultra 850G at Semicon West 2010

Industry News | 2010-07-02 14:58:37.0

Carlsbad, CA, July 2, 2010: Machine Vision Products today announced it would be demonstrating the Ultra 850G Semiconductor, Packaging and MicroElectronics AOI solution at the Semicon West 2010 exhibition. The exhibition is at the Moscone Center in San Francisco from July 13-15 2010. Machine Vision Products are exhibiting at booth #6362.

Machine Vision Products, Inc

Machine Vision Products Demonstrates Microelectronics and Packaging Inspection Capabilities of the Ultra 850G AOI at Semicon West 2011

Industry News | 2011-07-08 20:28:14.0

Carlsbad, CA: Machine Vision Products today announced it would be demonstrating the Ultra 850G Packaging and MicroElectronics AOI solution at the Semicon West 2011 exhibition. The exhibition is at the Moscone Center in San Francisco from July 12-14 2011. Machine Vision Products are exhibiting at booth #5368 in the North Hall.

Machine Vision Products, Inc

Digicom Electronics Upgrades Medical Device Quality Certification to ISO 13485:2016

Industry News | 2018-11-27 11:54:36.0

Digicom Electronics announces that it has upgraded its Medical Quality Device Certification to ISO 13485:2016. The ISO 13485 standard is a series of requirements that help device makers develop a quality management system to ensure the quality, safety, and effectiveness of the medical devices they manufacture. Digicom specializes in complex products and those that require the utmost precision, reliability, durability, and enhanced performance.

Digicom Electronics

Dow Electronic Materials to Showcase Leading Materials for Printed Circuit Board Manufacturing at the IPC APEX EXPO

Industry News | 2011-04-06 13:13:52.0

Dow Electronic Materials will showcase its innovative materials for printed circuit boards (PCBs) at this year’s IPC APEX EXPO. Dow will feature a number of its latest products that are tailored to meet the requirements of increasingly complex circuit boards while delivering ever-higher reliability and consistency. Dow’s next-generation of high quality, cost-effective technologies allow customers to meet future market requirements.

Dow Electronic Materials


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