Industry News: wire bonding (Page 3 of 29)

Nordson Electronics Solutions to demonstrate plasma treatment and automated fluid dispensing systems for electronics manufacturing at SEMICON China 2024

Industry News | 2024-03-11 15:00:03.0

Connect with our experts and see plasma and dispensing equipment for microelectronics manufacturing in booth 3645

Nordson Electronics Solutions

Find Inspiration for Innovation with New IPC APEX EXPO Activities in 2011

Industry News | 2011-01-12 17:40:04.0

Check out these Show Highlights, Ways to Save, Networking and Educational Opportunities, and Exhibition Preview.

Association Connecting Electronics Industries (IPC)

Success of CHIPS Act Depends on Quickly Establishing a Pilot Facility for Integrated Circuit Substrates, Tech Leaders Warn

Industry News | 2023-03-16 14:59:50.0

The success of the CHIPS for America program depends on establishing a U.S. pilot facility for manufacturing integrated circuit (IC) substrates; and getting it done sooner, incrementally, is better than doing it perfectly, according to a new industry report.

Association Connecting Electronics Industries (IPC)

IPC and IMAPS to Host On-Shoring Advanced Packaging and Assembly Workshop

Industry News | 2023-05-15 17:38:25.0

IPC and the International Microelectronics Assembly and Packaging Society (IMAPS) will host an "On-Shoring Advanced Packaging and Assembly," workshop July 10-12, 2023, in Washington, D.C.

Association Connecting Electronics Industries (IPC)

International Wafer-Level Packaging Conference (IWLPC) Workshops

Industry News | 2016-08-23 16:25:55.0

The SMTA and Chip Scale Review magazine are pleased to announce the Workshops for the 13th Annual International Wafer-Level Packaging Conference (IWLPC). On Thursday, October 20, there will be professional workshops given by instructors who are pre-eminent authorities in their fields. IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California.

Surface Mount Technology Association (SMTA)

Vertical Circuits and Asymtek Enable Next-Generation 3D Interconnect Technology

Industry News | 2008-07-24 17:38:17.0

Scotts Valley, CA � 15 July, 2008 - Vertical Circuits, Inc.(VCI), a leading supplier of advanced 3D die-level interconnect solutions, today announced its recognition of Asymtek, a Nordson company (Nasdaq: NDSN) and leader in dispensing, coating and jetting technologies, as a �Partner in Innovation.� Asymtek's Axiom� automated dispensing system plays a key role in enabling the high-volume manufacturing capability for VCI's 3D vertical interconnect process.

ASYMTEK Products | Nordson Electronics Solutions

Six IPC APEX EXPO Exhibiting Companies Earn 2020 Innovation Awards

Industry News | 2020-01-29 07:33:26.0

IPC announces the winners of the IPC APEX EXPO 2020 Innovation Awards, a celebration of the innovators who are changing the technological landscape of the electronics industry.

Association Connecting Electronics Industries (IPC)

ASYMTEK Products Elevates the Excellence of Electronics to New Heights with Advanced Dispensing, Coating, and Software Product Solutions at IPC APEX EXPO - Booth 1611

Industry News | 2020-01-23 17:30:46.0

ASYMTEK brings its latest fluid dispensing and conformal coating solutions to IPC APEX EXPO, San Diego, CA, in booth 1611. New at IPC APEX is the ASYMTEK Vortik™ family of progressive cavity pumps (PCP), with the smallest depositions possible on the market today. The VPs, VPm, and VPg pumps rely on positive displacement to provide continuous needle dispensing of one- and two-component fluids with high-volumetric accuracy, increased reliability, and reduced cycle time. At 0.2 microliters per second, the Vortik VPs offers the lowest flowrate and smallest depositions possible across all PCP pumps available in the market today - delivering precise control of narrow lines and small shots for two-component mixed fluids.

ASYMTEK Products | Nordson Electronics Solutions

Volunteers Honored for Contributions to Electronics Industry and IPC More than 140 Awards Presented at IPC APEX EXPO

Industry News | 2013-02-20 18:54:10.0

IPC — Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at the San Diego Convention Center.

Association Connecting Electronics Industries (IPC)

BEST Appoints Japanese Distributor for PCBV Rework/Repair Products

Industry News | 2009-07-22 10:45:59.0

BEST Appoints Japanese Distributor

BEST Inc.


wire bonding searches for Companies, Equipment, Machines, Suppliers & Information

High Throughput Reflow Oven

High Resolution Fast Speed Industrial Cameras.
ISVI High Resolution Fast Speed Industrial Cameras

Easily dispense fine pitch components with ±25µm positioning accuracy.
Pillarhouse USA for Selective Soldering Needs

High Throughput Reflow Oven
Electronics Equipment Consignment

World's Best Reflow Oven Customizable for Unique Applications


"回流焊炉"