Industry News: wire bonding (Page 8 of 29)

Cyber Technologies USA Appoints Representation for AZ, NM

Industry News | 2007-09-14 09:28:37.0

Chalman Technologies is new CT USA Representative

Cyber Technologies USA

AAT's Mega™ II Cleaner Ideal for Flip Chip, Advanced Package Cleaning

Industry News | 2001-06-26 09:50:17.0

The Mega™ II's revolutionary closed-loop, solvent (or water), electronic assembly and parts cleaning system with quantitative ION detection and statistical process control capability is ideal for Flip Chip, Optoelectronics, and advanced or high reliability technology packages and assemblies.

Austin American Technology

Machine Vision Products to demonstrate the Ultra 850G for Wire Bond Inspection and Microelectronic AOI applications at Semicon China 2012, Shanghai.

Industry News | 2012-03-15 09:55:33.0

Carlsbad, CA – March 15, 2012: Machine Vision Products (MVP), a leader in Automated Optical Inspection will be demonstrating its Microelectronics AOI systems applications at Semicon China 2012 in Shanghai from March 20 – 22. As leaders in price and performance AOI, MVP has demonstrated a high degree of adaptability of their systems throughout the 19 years of service to the industry. MVP will be exhibiting with Teltec SemiconductorPacific Limited at Booth #4435.

Machine Vision Products, Inc

Omni Circuit Boards Produces Working Aluminum Trace Circuit Board for Quantum Computing Applications

Industry News | 2013-07-30 12:55:21.0

Omni Circuit Boards, a British Columbia-based circuit board manufacturer, has announced the successful development of an aluminum monometal wire-bonded circuit board. The prototype, designed and manufactured for use in a D-Wave Systems quantum supercomputer, allows for superconductivity and operation in low temperatures just above absolute zero.

Omni Circuit Boards

MacDermid Alpha Releases HELIOFAB AG 7921 High-Brightness Silver for Leadframe Based LED Packages

Industry News | 2020-12-01 02:54:29.0

MacDermid Alpha Electronics Solutions announces the release of HELIOFAB AG 7921, a high brightness silver electroplating process for leadframe based LED packages.

MacDermid Alpha Electronics Solutions

Hesse & Knipps, Inc. Appoints New Technical Training Manager

Industry News | 2012-07-25 10:06:43.0

Hesse & Knipps, Inc.,has appointed Allan Camp as Technical Training Manager.

Hesse Mechatronics

Cyber Technologies USA Appoints Representation for Southern CA

Industry News | 2007-09-27 12:21:24.0

Techsystems International is now Cyber Technologies' Contact in the Region

Cyber Technologies USA

Cyber Techologies USA Appoints New Representation for Carolinas, Virginia

Industry News | 2007-10-11 14:26:03.0

i-TECH.com is the new Cyber Technologies Representative

Cyber Technologies USA

Engineered Material Systems Releases Die Attach for Light Emitting Diodes and Small Power Semiconductor Devices

Industry News | 2012-02-15 19:12:30.0

Engineered Material Systems has released its new DA-5045-2 and DA-5045-4 High Thermal Conductivity Die Attach Adhesives for attaching light emitting diodes (LEDs) and small die.

Engineered Materials Systems, Inc.

San Francisco Circuits Now Offers Micro-Circuits

Industry News | 2012-09-10 19:45:44.0

San Francisco Circuits is now offering Micro-Circuits.

San Francisco Circuits


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