Industry News | 2016-10-11 19:03:14.0
Nordson MARCH received the 2016 Global Technology Award for its FlexTRAK®-CDS high-volume plasma system at a ceremony held in conjunction with the SMTA International conference in Rosemont, IL on September 27, 2016. The system removes contamination, etches surfaces to improve adhesion, and provides surface activation prior to die attach, wire bond, mold encapsulation, and underfill to lead frame strips, laminated substrates, and other strip-type electronic components.
Industry News | 2024-09-23 20:27:15.0
PEMTRON is pleased to announce plans to exhibit at the TPCA Show, scheduled to take place Oct. 23-25, 2024 in Taipei, where it will showcase its latest innovations in inspection equipment. Visitors to Booth will have the opportunity to explore four state-of-the-art systems: POSEIDON, 8800AI, 8800FI and JUPITER, each designed to enhance precision, efficiency and quality control.
Industry News | 2006-09-12 13:19:59.0
ENDICOTT, NY, September 12, 2006
Industry News | 2007-01-05 12:35:32.0
ENDICOTT, NY
Industry News | 2008-02-19 10:11:00.0
Endicott Interconnect Technologies, Inc. (EI) announced today that they have again achieved platinum level status for surpassing the $100,000 mark in contributions to the United Way of Broome County for the fourth year in a row.
Industry News | 2012-02-22 01:32:21.0
Engineered Material Systems introduces its DE-7826 (dam) and CE-7826 (fill) Dam and Fill Chip Encapsulants for chip-on-board (COB) applications.
Industry News | 2012-09-10 09:15:27.0
MARTIN will be one of nine companies participating in the Package on Package Design and Assembly Center (PoP Center) at SMTA International this year.
Industry News | 2013-04-29 12:50:23.0
Engineered Material Systems debuts its CA-105 Low-Cost Conductive LED Die Attach Adhesive for attaching LEDs and other small semiconductor die to silver and copper lead frames.
Industry News | 2013-09-05 20:26:22.0
Engineered Material Systems , a leading global supplier of electronic materials for circuit assembly applications debuts its CA-195 High Thermal Conductivity, Low Cost Electrically Conductive LED Die Attach Adhesive for attaching LED and other small semiconductor die to silver and copper lead frames.
Industry News | 2015-06-18 17:55:13.0
Indium Corporation and the Empire Chapter of the International Microelectronics Assembly and Packaging Society (IMAPS), in association with the State University of New York (SUNY), will host an Advanced Technology Workshop and Tabletop Exhibition on Advances in Semiconductor Packaging on Sept. 24 at SUNY Polytechnic Institute in Marcy, N.Y.
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