Industry News: wire bonding (Page 10 of 29)

Pemtron Hires New Engineer in Brazil

Industry News | 2023-06-07 19:47:49.0

Pemtron Technology is pleased to announce the addition of Fabio Pareira to its engineering team. With more than 20 years of experience in Surface Mount Technology (SMT) processes, Fabio brings a wealth of expertise to Pemtron's operations in Brazil. His extensive knowledge in SMT equipment, process optimization, and product quality will further enhance Pemtron's ability to deliver innovative solutions to its customers.

Pemtron

Inspection Technologies from Viscom at NEPCON Vietnam

Industry News | 2023-09-04 14:26:39.0

A well-prepared team from Viscom Asia is ready to welcome visitors to NEPCON Vietnam 2023 in Hanoi. Two machines will represent the wide range of inspection systems developed and manufactured at Viscom AG in Germany: iX7059 PCB Inspection XL (3D AXI) and S3088 ultra chrome (3D AOI). In combination, they cover 100% of today's post-reflow inspection requirements.

Viscom AG

Endicott Interconnect Technologies, Inc. Achieves Platinum Award for United Way Contributions

Industry News | 2008-02-19 10:11:00.0

Endicott Interconnect Technologies, Inc. (EI) announced today that they have again achieved platinum level status for surpassing the $100,000 mark in contributions to the United Way of Broome County for the fourth year in a row.

i3 Electronics

Engineered Material Systems Introduces New Dam and Fill Chip Encapsulants for Circuit Assembly Applications

Industry News | 2012-02-22 01:32:21.0

Engineered Material Systems introduces its DE-7826 (dam) and CE-7826 (fill) Dam and Fill Chip Encapsulants for chip-on-board (COB) applications.

Engineered Materials Systems, Inc.

MARTIN to Participate in Package on Package (PoP) Design and Assembly Center SMTA International 2012

Industry News | 2012-09-10 09:15:27.0

MARTIN will be one of nine companies participating in the Package on Package Design and Assembly Center (PoP Center) at SMTA International this year.

Finetech

A New Low-Cost Conductive LED Die Attach Adhesive Is Now Available for Small Die and LEDs

Industry News | 2013-04-29 12:50:23.0

Engineered Material Systems debuts its CA-105 Low-Cost Conductive LED Die Attach Adhesive for attaching LEDs and other small semiconductor die to silver and copper lead frames.

Engineered Materials Systems, Inc.

New High Thermal Conductivity LED Die Attach Adhesive for Small Die and LEDs from Engineered Material Systems

Industry News | 2013-09-05 20:26:22.0

Engineered Material Systems , a leading global supplier of electronic materials for circuit assembly applications debuts its CA-195 High Thermal Conductivity, Low Cost Electrically Conductive LED Die Attach Adhesive for attaching LED and other small semiconductor die to silver and copper lead frames.

Engineered Materials Systems, Inc.

Indium Corporation and IMAPS Empire Chapter to Host "Advances in Semiconductor Packaging" Workshop in September

Industry News | 2015-06-18 17:55:13.0

Indium Corporation and the Empire Chapter of the International Microelectronics Assembly and Packaging Society (IMAPS), in association with the State University of New York (SUNY), will host an Advanced Technology Workshop and Tabletop Exhibition on Advances in Semiconductor Packaging on Sept. 24 at SUNY Polytechnic Institute in Marcy, N.Y.

Indium Corporation


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