Industry News: wire bonding (Page 10 of 24)

New High Thermal Conductivity LED Die Attach Adhesive for Small Die and LEDs from Engineered Material Systems

Industry News | 2013-09-05 20:26:22.0

Engineered Material Systems , a leading global supplier of electronic materials for circuit assembly applications debuts its CA-195 High Thermal Conductivity, Low Cost Electrically Conductive LED Die Attach Adhesive for attaching LED and other small semiconductor die to silver and copper lead frames.

Engineered Materials Systems, Inc.

Indium Corporation and IMAPS Empire Chapter to Host "Advances in Semiconductor Packaging" Workshop in September

Industry News | 2015-06-18 17:55:13.0

Indium Corporation and the Empire Chapter of the International Microelectronics Assembly and Packaging Society (IMAPS), in association with the State University of New York (SUNY), will host an Advanced Technology Workshop and Tabletop Exhibition on Advances in Semiconductor Packaging on Sept. 24 at SUNY Polytechnic Institute in Marcy, N.Y.

Indium Corporation

EMEA Electro Solutions is new Viscom sales partner in Spain and Portugal

Industry News | 2015-07-23 19:58:52.0

EMEA Electro Solutions, headquartered in Barcelona, is taking over Viscom representation in Spain and Portugal. The team from EMEA is the new strong partner on the Iberian peninsula, with 15 years' experience in SMT, THT, microelectronics, ESD products and product finishing. With his long-term experience in the industry and what by now is several years of close cooperation with Viscom, José Luis Pardo, the founder of the company, is a well-known and competent contact partner for customers and other interested persons.

Viscom AG

NEO Tech Receives Microelectronics Reaccreditation from DMEA

Industry News | 2018-09-18 19:55:05.0

NEO Tech announces that it received reaccreditation by the Department of Defense, Defense Microelectronics Activity (DMEA), furthering its reputation as a leader in the microelectronics industry.

NEO Technology Solutions (NEO Tech)

KYZEN to Launch New Multi-Metal Safe Power Module Cleaner at SEMICON West

Industry News | 2021-11-12 04:18:41.0

KYZEN will have an exciting new product introduction at SEMICON West. The show is back as a hybrid event from Dec. 7-9, 2021. The live, in-person event will take place at the Moscone Center in San Francisco, California. A virtual environment also will be available. KYZEN's MICRONOX® MX2120 Multi-Metal Safe Power Module Cleaner will be introduced at the event in Booth #1750.

KYZEN Corporation

What are the USES of UVLE curing machine and UVLED vacuum oven?

Industry News | 2019-12-16 22:07:54.0

UVLED curing machine is generally used for UV glue, UV ink and other UV coating curing, can achieve the purpose of rapid deep curing, the principle is UV irradiation special glue causes glue to produce polymerization reaction to cure.

Beijing Technology Company

Indium Corporation Technology Experts to Present at IMAPS.

Industry News | 2014-08-26 14:51:55.0

Indium Corporation technology experts will share their expertise at the 47th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) Oct. 14-16 in San Diego, Calif.

Indium Corporation

Digicom Electronics Incorporates Nitrogen in Soldering and Reflow Processes to Maximize Device Reliability

Industry News | 2016-10-06 10:10:53.0

Digicom Electronics now generates its own nitrogen to use in its solder reflow, selective soldering, and hand soldering manufacturing processes to strengthen the bonds and improve solder adhesion. Adding nitrogen minimizes device failure and ensures printed circuit board integrity, especially for mission critical products for the medical, military and aerospace, industrial, and RF wireless industries. The addition of nitrogen is part of Digicom's Diamond Track Manufacturing Processes.

Digicom Electronics

More power for European electromobility - Heraeus and Danfoss start cooperation for production of state-of-the-art control modules for electric motors / Heraeus Electronics opens new production line i

Industry News | 2022-04-28 15:05:22.0

In times of climate change and increases in energy use, the demands of power modules for the efficient and reliable control of electric motors continue to rise. Modern module concepts are reaching their limits in terms of power density, current carrying capacity, and reliability to increase lifetime and reduce costs. A critical area for improving power modules is the material system used in them, as well as their electrical and thermal interconnection.

Heraeus

Use of Pressurex Pressure Indicating Sensor Film Increases Bond Strength and Reduces Defects in Ultrasonic Welding of Electronics

Industry News | 2010-02-19 09:45:37.0

Pressurex® Sensor Film Needed to Measure Contact Pressure In Ultrasonic Welding

Sensor Products Inc.


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