Industry News | 2009-04-23 20:46:52.0
FINETECH Product Manager Dominik Horn will give a presentation titled �QFN Rework in OEM Quality� at the upcoming SMT/HYBRID/PACKAGING Exhibition & Conference, scheduled to take place Wednesday, May 6, 2009 from 1:40-2 p.m.
Industry News | 2010-10-01 01:05:06.0
Finetech will highlight two rework systems ― the FINEPLACER® core and the Martin Expert 10.6XL ― and the Martin Reball 3.1 unit in booth 406 at the upcoming SMTA International, scheduled to take place October 26-27, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Industry News | 2013-03-22 11:46:06.0
ASC International announces that Distron Corporation, based in Attleboro Falls, MA, has successfully implemented a true 3D inline SPI system. This investment demonstrates Distron’s long-term commitment to high-quality products.
Industry News | 2009-06-02 14:13:36.0
With the majority of the electronics industry fully on board with lead-free manufacturing, solder paste materials requirements are now moving beyond basic functionality and toward more advanced, truly enabling capabilities.
Industry News | 2023-07-03 19:52:11.0
Heraeus Electronics is excited to announce its participation in SEMICON China, scheduled to take place June 29 - July 1, 2023 at the Shanghai New International Expo Center (SNIEC). Heraeus Electronics will showcase its innovative range of semiconductor packaging materials and printed electronics in booth E7355, Hall E7.
Industry News | 2021-11-30 20:11:40.0
ASHCROFT pressure transmitter is one of the most commonly used transmitters in industrial applications. It is widely used in a variety of control environments, involving water conservancy and hydropower, railway transportation, intelligent building, production automation, aerospace, military, petrochemical, oil wells, electric power, ships, machine tools and pipelines.
Industry News | 2012-01-21 00:40:52.0
Essemtec will showcase flexible Swiss-made solutions in Booth #1617 at the upcoming IPC APEX Expo.
Industry News | 2013-04-10 11:48:47.0
Essemtec, announces that it will exhibit numerous flexible Swiss-made solutions in Booth 7, Hall 211 at the SMT Hybrid Packaging exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.
Industry News | 2007-10-30 00:56:03.0
Aesch/Switzerland � Essemtec AG, Switzerland, a leading manufacturer of surface mount technology production equipment, announces that it will highlight CSM7100V, a highly flexible pick-and-place system with intelligent feeders and vision for high-mix/low-volume production, in booths A5-277 and A5-278 at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the New Munich Trade Fair Center in Munich, Germany.
