Industry News | 2016-05-31 20:58:06.0
SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.
Industry News | 2020-12-18 11:15:50.0
New Excel Cell Electronic ZIF Type Board-to-FPC Connectors are used in Medical Ventilators, Computers, and Security Applications
Industry News | 2021-02-18 15:54:21.0
Vishay Beyschlag Precision Automotive Grade Thin Film Chip Resistor Arrays are enhanced with Higher Resistance Ratios up to 1:100 and Operating Voltages up to 100V
Industry News | 2024-03-19 15:08:02.0
Custom designed garage for 2 Europlacer SMT Feeder Carts , No need to remove reels for controlled dry storage , saves floor time ! .
Industry News | 2008-04-07 21:09:26.0
FINETECH announces that it will display the FINEPLACER� Lambda system at the upcoming NEPCON China 2008 trade show and exhibition, scheduled to take place April 8 to 11, 2008, in Shanghai, China. This high precision bonder provides a placement accuracy of � 0.5 micron.
Industry News | 2011-12-30 23:26:12.0
Nihon Superior has highlighted the effectiveness of Cu and Ni as the essential elements in forming a stable IMC layer in lead-free soldering.
Industry News | 2016-02-25 14:29:00.0
SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.
Industry News | 2016-09-22 17:41:20.0
Pickering Electronics will be showcasing its latest high density range at electronica on 8 – 11, November 2016 in booth B1.550.
Industry News | 2016-10-16 19:10:53.0
Pickering Electronics will be showcasing its latest high density range at the International Test Conference on booth 216, 15 – 17 November 2016.
