Industry News: 0

New Yorker Electronics Introduces the Autec Power Systems new Industrial Desktop Power Adapter

Industry News | 2021-01-05 10:59:12.0

Autec's 'The Eclipse' Power Adapter Achieves Level VI Efficiency and is Available in Two Power Ratings

New Yorker Electronics

New Yorker Electronics Expands Metal Strip Power Shunt Resistors with VPG 2-Terminal Resistors

Industry News | 2022-09-16 17:11:00.0

VPG Foil Resistors Line of 2-Terminal Power Resistors Provide Low Resistance Values and Improved TCR under High Stress Conditions

New Yorker Electronics

Stencil thickness calculations

Industry News | 2018-10-18 10:15:06.0

Stencil thickness calculations

Flason Electronic Co.,limited

FINETECH to Showcase Sub-Micron Bonder at SPIE Photonics West 2011

Industry News | 2011-01-05 15:36:14.0

FINETECH will showcase the FINEPLACER® Lambda in Booth 2204 at the upcoming SPIE Photonics West exhibition, scheduled for January 22-27, 2011 at the Moscone Center in San Francisco.

Finetech

High-Accuracy R&D Die Bonder on Display at Finetech Booth #505 at IMAPS 2012 – San Diego

Industry News | 2012-09-05 08:13:47.0

Finetech will showcase the FINEPLACER® Lambda in Booth #505 at the upcoming IMAPS 45th International Symposium on Microelectronics exhibition

Finetech

IMS Releases Compact Thick Film 7GHz SMT Wilkinson Power Divider

Industry News | 2013-05-23 21:38:41.0

International Manufacturing Services, Inc. (IMS) announces the availability of its compact Thick Film 7GHz SMT Wilkinson Power Divider.

International Manufacturing Services (IMS)

Balver Zinn to Demonstrate New i-SAC Series of Optimized Solder at Productronica 2009

Industry News | 2009-12-07 17:55:23.0

BALVE, GERMANY — November 2009 — The BALVER ZINN Group, a leading provider of high-quality alloyed solder anodes, as well as special cored and solid wires, will demonstrate the new i-SAC series of optimized Alloyed Lead-Free Solders in Hall A4, Stand 570 of the upcoming Productronica exhibition - scheduled to take place 10th – 13th November 2009 at the New Munich Trade Fair Center in Munich, Germany.

Balver Zinn

Nihon Superior’s Keith Sweatman to Present at TMS 2010

Industry News | 2010-02-08 12:11:13.0

OSAKA, JAPAN — February 2010 — Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that Keith Sweatman will present a paper titled “The Relationship between Whisker Growth and Corrosion in Sn-3.0Ag-0.5Cu” at the upcoming TMS 2010 Annual Meeting & Exhibition, scheduled to take place February 14-18, 2010 at the Washington State Convention Center in Seattle.

Nihon Superior Co., Ltd.

Now Available: Placing Force Measurement Option on FLX2011

Industry News | 2012-03-30 13:42:24.0

New technologies such as package on package (PoP) component assembly or bare die assembly on COB applications, as well as the optimization of material consumption demands for increased knowledge of the actual placement forces.

ESSEMTEC AG

Pickering To Showcase Ultra-High Density Reed Relays at Electronica

Industry News | 2016-09-22 21:57:52.0

Pickering Electronics will be showcasing its latest high density range at electronica on 8 – 11, November 2016 in booth B1.550.

Pickering Electronics


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