Industry News: 0-300 (Page 1 of 1)

Field Application Engineer Tony Lentz to Present at SMTAI

Industry News | 2014-08-28 11:13:11.0

FCT Assembly today announced that Field Application Engineer Tony Lentz will present paper titled “Performance Enhancing Nano Coatings: Changing the Rules of Stencil Design” at the upcoming SMTA International exhibition.

FCT ASSEMBLY, INC.

FCT Assembly’s Tony Lentz Receives Glowing Speaker Evaluation from SMTA

Industry News | 2014-11-04 17:42:23.0

FCT Assembly today announced that field application engineer, Tony Lentz, received high scores for his presentation during SMTAI. Lentz presented the paper titled “Performance Enhancing Nano Coatings: Changing the Rules of Stencil Design” in Rosemont, IL last month.

FCT ASSEMBLY, INC.

ECT’s CPG To Feature Leading Electrical Test Technologies At APEX 2010

Industry News | 2010-03-22 14:33:44.0

Pomona, CA, March 2010 — Everett Charles Technologies (ECT) Contact Products Group (CPG) will feature the latest electrical test technologies in booth 1283 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas.

Everett Charles Technologies

Isola Introduces Ultra-Low Loss Materials for Applications Over 100 Gbps

Industry News | 2014-02-05 10:37:27.0

Isola Group has begun alpha testing of Tachyon, its new ultra-low loss product that is engineered to reduce insertion loss on high-peed digital designs. It is specifically being targeted for high-layer count backplanes for the growing 100 gigabit per second (Gbps) market that has channel data rates in excess of 25 Gbps.

Isola Group

Isola Introduces Ultra-Low Loss Materials for 100 Gigabit Ethernet Applications

Industry News | 2014-06-26 20:12:53.0

Isola Group announced the introduction of Tachyon-100G laminates and prepregs, which enable line cards required to transmit 100 Gigabit Ethernet (100GbE) at data rates in excess of 25 Gb/s per channel. Tachyon-100G has identical electrical properties as its predecessor Tachyon; however, the Z-axis coefficient of thermal expansion (CTE) on Tachyon-100G is more than 30% lower than Tachyon, making it more suitable for fabricating high-layer count, 0.8 mm pitch line cards with heavy 2 oz. copper inner layers.

Isola Group

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