Industry News | 2011-03-28 13:24:06.0
Eleven products have been selected for inclusion in the Innovative Technology Center at IPC APEX EXPO™, April 12–14, 2011, in Las Vegas, according to show organizer IPC – Association Connecting Electronics Industries. Assessed by a review board of industry experts, the products were selected based on their representation of a new or emerging technology of significant value and relevance to the electronics manufacturing industry.
Industry News | 2011-06-29 16:51:09.0
IPC announced today the May findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
Industry News | 2011-12-01 13:37:50.0
IPC announced the October findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
Industry News | 2012-08-28 16:26:16.0
IPC — Association Connecting Electronics Industries® announced today the July findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
Industry News | 2012-09-28 09:00:14.0
IPC — Association Connecting Electronics Industries® announced today the August findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
Industry News | 2012-10-31 12:45:24.0
IPC — Association Connecting Electronics Industries® announced today the September findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
Industry News | 2013-06-28 18:52:56.0
IPC announced today the May findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. The PCB book-to-bill ratio stayed strong for the sixth consecutive month, remaining at 1.10, an indication that recovery from nearly a two-year slump may be starting.
Industry News | 2013-09-03 11:52:21.0
BEST's EZReball(TM) reballing preforms now are available as standard in 3 business days. Expedited packs are in available in 24 hours to help you with your reballing projects
Industry News | 2011-12-30 23:26:12.0
Nihon Superior has highlighted the effectiveness of Cu and Ni as the essential elements in forming a stable IMC layer in lead-free soldering.
Industry News | 2012-01-17 11:05:35.0
Practical Components introduces a test board for its dummy (mechanical sample) version of Amkor’s cutting-edge 0.3 mm pitch CVBGA. Amkor’s new semiconductor device is a wafer-scale package in a miniature package, which is suitable for installation in surface mount technology (SMT). Amkor’s ChipArray® range of packages consists of laminate-based ball grid array (BGA) packages that are compatible with established SMT mounting processes.
