Industry News | 2018-10-15 18:31:07.0
Practical Components announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 – 15th Annual International Wafer-Level Packaging Conference. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The event will take place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose in San Jose, CA.
Industry News | 2018-10-18 19:55:33.0
Practical Components announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 – 15th Annual International Wafer-Level Packaging Conference. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The event will take place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose in San Jose, CA.
Industry News | 2019-01-05 16:48:58.0
Practical Components is a premier supplier to the global electronics industry specializing in mechanical IC samples or “dummy” components, evaluation PCBs and solder training kits. Practical will feature its latest technology in booth 1609 at the upcoming IPC APEX EXPO 2019 exhibition and convention, scheduled to take place January 29-31, 2019 at the San Diego Conference Center in California.
Industry News | 2002-04-04 08:15:27.0
47.6% Drop From $4.3 Million in the Like Period a Year and a 14.8% Decline From $2.7 Million in the Previous Period
Industry News | 2011-10-12 21:39:45.0
Multitest announces that the Santa Clara board fab has refined its pulse plating process to integrate it into Multitest’s fabrication process to further enhance the high aspect ratio capability.
Industry News | 2012-08-20 13:00:35.0
Multitest, announces that its Pulse Plating Process provides significant advantages in terms of fabrication cost and cycle time.
Industry News | 2012-08-20 13:01:17.0
Multitest, announces that its Pulse Plating Process provides significant advantages in terms of fabrication cost and cycle time.
Industry News | 2009-01-03 14:41:49.0
Toronto, Canada - GAO Tek Inc. has released a newly designed 865MHz to 928MHz Gen 2 Passive Tag called the �Cruiser� (GAO 116408). This RFID tag is designed specifically to be applied to the inside of the tire during the tire building process and is designed to withstand the high heat and pressure required during the tire curing process.
Industry News | 2017-07-06 09:53:39.0
SHENMAO Technology introduces New Generation Ultra Low Residue Liquid Flux SMF-B51 with superior spray uniformity, excellent soldering performance and a wide process window for Chip Scale and Fan Out Wafer Level Packaging.
Industry News | 2017-07-09 20:40:11.0
SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.
