Industry News | 2013-05-11 22:01:39.0
The MPM® EnclosedFlow™ print head by Speedline Technologies is a revolutionary enclosed media printing technology that offers significant process and cost advantages over printing with metal squeegee blades. Solder paste is held within an enclosed chamber, and is directly pressurized during the print stroke to provide uniform and complete aperture filling for the full range of aperture sizes and fill types.
Industry News | 2013-09-16 14:38:01.0
VJ Electronix, Inc. and BEST, Inc. announce that Don Naugler and Bob Wetterman will be presenting a paper during technical session SMT3 BGA Profiling and Reballing at the upcoming SMTA International in Fort Worth, TX.
Industry News | 2013-10-08 14:47:36.0
The Balver Zinn Group announces that it will exhibit in Hall A4, Stand 451 at the 20th international Productronica Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
Industry News | 2013-10-09 09:50:45.0
The Balver Zinn Group today announced that it will sponsor the IPC hand soldering competition at Productronica, scheduled to take place November 12-15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
Industry News | 2018-01-18 04:01:33.0
Cobar Solder Products Inc. part of the Balver Zinn Group announces that it will exhibit together with Amerway Inc. in Booth #2502 at the IPC APEX EXPO, scheduled to take place February 27 – March 1, 2018 at the San Diego Convention Center, California.
Industry News | 2015-05-26 21:36:49.0
Japan Unix announces a speed upgrade to its flash soldering Unix FS Series. The innovative flash soldering laser system is two times faster than a typical laser and can integrate pre- and post-soldering processes such as surface mount and through-hole devices. In addition to increasing speed, the Series can improve productivity.
Industry News | 2018-08-31 12:50:11.0
Versatile programmable AC+DC power sources suit a variety of test situations and power simulations
Industry News | 2015-12-04 13:06:33.0
December 3, 2015 – Continuing to invest in the most advanced stencil production technologies, FCT Assembly’s Fine Line Stencil division today announced that it has added a next-generation micro-milling system to its operation to enable production of highly-accurate step -- or multi-level -- stencils.
Industry News | 2019-04-23 07:49:30.0
Metcal today announced plans to exhibit with smartTec at SMTconnect, scheduled to take place May 7-9, 2019 at the Nuremberg Messe GmbH in Nuremberg, Germany. Company representatives will demonstrate the Connection Validation (CV) CV-5210 Soldering System with new hand-pieces, BVX-201 Fume Extractor and AC-STC Solder Tip Cleaner in Hall 4, Booth 101. Additionally, smartTec will hold a drawing for a chance to win a CV-5210.
Industry News | 2019-09-25 16:15:46.0
Practical Components announces that it will exhibit in booth 31 at the 2019 International Wafer-Level Packaging Conference (IWLPC) from October 22-23, 2019 at DoubleTree by Hilton in San Jose, CA. Practical Components has added many new Test Wafers for miniaturized Surface Mount Technology (SMT) to its array of Dummy Components, Solder Training Kits and PCB Evaluation Kits.
