Industry News: 0.3 mm pitch (Page 9 of 43)

Practical Components to Debut Advanced Technologies at IWLPC

Industry News | 2019-09-25 16:15:46.0

Practical Components announces that it will exhibit in booth 31 at the 2019 International Wafer-Level Packaging Conference (IWLPC) from October 22-23, 2019 at DoubleTree by Hilton in San Jose, CA. Practical Components has added many new Test Wafers for miniaturized Surface Mount Technology (SMT) to its array of Dummy Components, Solder Training Kits and PCB Evaluation Kits.

Practical Components, Inc.

ECT's Contact Solutions to Showcase ZIP® Family at BiTS™ Burn-In & Test Socket Workshop

Industry News | 2012-02-10 16:30:05.0

Everett Charles Technologies’ (ECT) Contact Solutions will highlight the ZIP® family at the upcoming Burn-In & Test Strategies Workshop.

Everett Charles Technologies

ECT’s CPG TO SHOWCASE THE ZIP® FAMILY AT THE INTERNATIONAL TEST CONFERENCE

Industry News | 2011-08-24 13:24:13.0

Everett Charles Technologies (ECT) Contact Products Group (CPG) will showcase the latest additions to its ZIP® family of “flat” technology Pogo® pins in booth 114 at the upcoming International Test Conference (ITC)

Everett Charles Technologies

Christopher Associates Premiers Solder Pastes from Koki for ICT Performance and Fine-Pitch Printing

Industry News | 2009-12-14 20:45:09.0

December 2009 ? Christopher Associates, a pioneering supplier and distributor to the electronics and chemical processing industries, introduces two new solder pastes from Koki Company Ltd. (Tokyo, Japan).

Christopher Associates Inc.

The Design Principles of Stencil Apertures

Industry News | 2018-10-18 10:24:05.0

The Design Principles of Stencil Apertures

Flason Electronic Co.,limited

Fine Line Stencil Upgrades Step Stencil Technology

Industry News | 2015-12-04 13:06:33.0

December 3, 2015 – Continuing to invest in the most advanced stencil production technologies, FCT Assembly’s Fine Line Stencil division today announced that it has added a next-generation micro-milling system to its operation to enable production of highly-accurate step -- or multi-level -- stencils.

FCT ASSEMBLY, INC.

Europlacer Will Demonstrate Its Full Line Configuration at productronica

Industry News | 2015-10-21 20:40:10.0

Europlacer will exhibit in Hall A2, Booth 439 at the productronica International Trade Fair, scheduled to take place Nov. 10-13, 2015 at the Messe München exhibition center in Munich, Germany. Europlacer will demonstrate its full line configuration, representing unparalleled flexibility and value. Core to the configuration is the ability to manage the entire SMT line without compromise.

EUROPLACER

Test Interface Boards – Multitest Meets Today'Fine-Pitch Requirements

Industry News | 2011-10-12 21:39:45.0

Multitest announces that the Santa Clara board fab has refined its pulse plating process to integrate it into Multitest’s fabrication process to further enhance the high aspect ratio capability.

Multitest Elektronische Systeme GmbH

Practical Components to Exhibit Its Latest Technologies at APEX 2015

Industry News | 2015-02-10 17:26:13.0

Practical Components announces that it will display its latest technology in booth 3939 at the upcoming IPC APEX EXPO 2015 exhibition and conference, scheduled to take place February 24-26, 2015 at the San Diego Conference Center in California.

Practical Components, Inc.

Practical Components to Exhibit Its Latest Technologies at Productronica 2015

Industry News | 2015-11-03 10:54:44.0

LOS ALAMITOS, CA — November 2015 — Practical Components, a leading international distributor of mechanical IC samples or “dummy” components and SMD production tools and equipment, announces that it will showcase its latest technology in representative AAT Aston’s exhibit at Hall A2 Stand 578 scheduled to take place November 10-13, 2015 at the New Munich Trade Fair Center in Munich, Germany.

Practical Components, Inc.


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