Industry News | 2009-11-11 13:39:57.0
Paraquda is the newest SMD pick-and-place machine that Essemtec has introduced at the Productronica exhibition in Munich, Germany. The machine sets a new standard for flexible placement machines: Drive technologies, materials and software are state-of-the-art, machine operation is a user friendly and the application range is wider than ever before.
Industry News | 2015-07-08 13:37:22.0
Pickering Electronics are releasing their new Series 119 range for up to 3kV at Semicon West 2015. This will be the industry’s smallest high voltage Single-In-Line Reed Relay available. The relay is intended for voltages considerably higher than standard small SIL relays, ideal for Cable and Backplane Testers, Mixed signal ATE or other applications where High Voltage capability is required.
Industry News | 2015-08-18 14:23:53.0
Pickering Electronics have announced the addition of Form B (energize to break) reed relays to their new Series 119 high voltage micro-SIL relay range. This is the industry’s smallest high voltage Single-In-Line Reed Relay now available. The relay is intended for voltages considerably higher than standard small SIL relays, ideal for Cable and Backplane Testers, Mixed signal ATE or other applications where High Voltage capability is required.
Industry News | 2015-10-05 17:39:33.0
Pickering Electronics are set to showcase new Single-in-Line (SIL) Reed Relays for high voltage applications at productronica this November. The new Series 119 is the industry’s smallest high voltage SIL Reed Relay for up to 3kV stand-off. This new relay is intended for voltages considerably higher than standard small SIL relays, ideal for Cable and Backplane Testers and Mixed signal ATE.
Industry News | 2015-10-05 17:43:22.0
Pickering Electronics have expanded their Reed Relay range to include three new series, that all offer higher packing densities. The Series 67 and 68 dry Reed Relay range for up to 10kV, and the Series 119 Micro-SIL range for up to 3kV.
Industry News | 2017-04-12 14:58:07.0
Pickering Electronics will be showcasing its latest High Voltage Reed Relays at the Teradyne Users Group Vendor Fair on 2nd May 2017 on booth #14.
Industry News | 2003-06-13 10:10:58.0
By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.
Industry News | 2008-02-29 16:13:23.0
Glassboro, NJ � Essemtec, a leading manufacturer of surface mount technology production equipment, announces that it will debut the FLX2010-BLV SMD pick-and-place system in booth 501 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.
Industry News | 2013-02-25 18:32:14.0
Equipment Services, LLC has introduced a new line of ESE US-X Series solder-paste printers to the North American PCB assembly market. The advanced-technology SMT screen printers, which feature 2-D solder-paste inspection as standard, are built in Korea to the highest level of quality.
Industry News | 2010-11-30 13:30:04.0
Ironwood Electronics' new package converter - PC-BGA256B/BGA256E-B-01 allow previous product version to be used in the new system boards for test/validation until the new BGA device is released from the foundry or vice versa. These package converters can be soldered directly onto the SMT pads of development boards using standard solder methods.
