Industry News: 0.3 pitch qfn (Page 2 of 9)

MARTIN to Demonstrate Standalone QFN Solder Bumping and BGA Reball Unit at SMTA Capital Expo

Industry News | 2010-09-15 21:55:19.0

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Capital Expo and Tech Forum, scheduled to take place Tuesday, September 21, 2010 at the Johns Hopkins University/Applied Physics Lab in Laurel, MD.

Finetech

MARTIN to Demonstrate Stand Alone QFN Solder Bumping and BGA Reball Unit at the CTEA Austin Expo & Tech Forum

Industry News | 2010-10-04 15:37:18.0

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming Central Texas Electronics Association (SMTA/IMAPS) Expo & Tech Forum, scheduled to take place, October 7, 2010 at the Norris Conference Centers in Austin, TX.

Finetech

MARTIN to Demonstrate Stand Alone QFN Solder Bumping and BGA Reball Unit at the SMTA Arizona-Sonora Expo & Tech Forum

Industry News | 2010-11-18 11:04:08.0

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Arizona-Sonora Expo & Tech Forum, scheduled to take place Wednesday, December 1, 2010 at the Fiesta Inn Resort & Conference Center in Tempe, AZ.

Finetech

Multitest’s Gemini™ Contactor Chosen as Standard by Major Semiconductor IDM

Industry News | 2010-08-27 22:49:53.0

Multitest announces that its Gemini™ series contactors have been chosen by another major semiconductor IDM as the contactor of choice for QFN packages. Gemini™ outperformed the competition in multiple categories over months of evaluation.

Multitest Elektronische Systeme GmbH

Practical Components Adds Quik-Pak™ Open-molded Quad Flat Pack No Leads OmQFN is ideal for prototype, mid-volume or production volume applications

Industry News | 2012-04-17 10:06:22.0

Practical Components Inc., a leading supplier of dummy components, introduces the Practical Dummy Component® version of pre-molded QFN packages.

Practical Components, Inc.

MARTIN to Demonstrate BGA Reball/Pre-Bump Unit at the SMTA Space Coast Expo & Tech Forum

Industry News | 2011-05-10 19:11:40.0

MARTIN will showcase its Mini-Oven 04 Reball/Prebump unit at the upcoming Space Coast Expo and Tech Forum, scheduled to take place June 9, 2011 at the Melbourne Auditorium in Melbourne, FL.

MARTIN (a Finetech company)

MARTIN to Demonstrate Mini-Oven Reball/Solder Bumping Unit at SMTA LA/Orange County Expo

Industry News | 2011-10-07 23:08:54.0

MARTIN will showcase its Mini-Oven Reball/Solder Bumping unit at the upcoming SMTA LA/Orange County Expo & Tech Forum.

MARTIN (a Finetech company)

MARTIN to Demonstrate Mini-Oven Reball/PreBump Unit at the Mississauga EPTECH Electronics Show

Industry News | 2012-09-26 07:31:28.0

MARTIN will showcase its Mini-Oven Reball/Prebump unit and Expert 10.6 rework system at the upcoming Mississauga EPTECH Electronics Show,

Finetech

FINETECH to Present at SMT/HYBRID/PACKAGING

Industry News | 2009-04-23 20:46:52.0

FINETECH Product Manager Dominik Horn will give a presentation titled �QFN Rework in OEM Quality� at the upcoming SMT/HYBRID/PACKAGING Exhibition & Conference, scheduled to take place Wednesday, May 6, 2009 from 1:40-2 p.m.

Finetech

MARTIN to Demonstrate BGA Reball/Pre-Bump Unit at the SMTA Dallas and Houston Expo & Tech Forums

Industry News | 2011-02-17 14:59:07.0

MARTIN will showcase its Mini-Oven 04 Reball/Prebump unit at the upcoming SMTA Dallas and Houston Expo & Tech Forums. The SMTA Dallas Expo & Tech Forum is scheduled to take place Tuesday, March 1, 2011 at the Richardson Civic Center in Richardson, TX and the SMTA Houston Expo & Tech Forum is scheduled to take place Thursday, March 3, 2011 at the Stafford Centre in Stafford, TX.

Finetech


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