Industry News: 0.3 pitch qfn (Page 8 of 9)

Surface Mount (SMT) Assembly Cost in China

Industry News | 2018-10-18 11:28:37.0

Surface Mount (SMT) Assembly Cost in China

Flason Electronic Co.,limited

High Mix SMD Pick+Place

Industry News | 2004-10-15 10:33:00.0

The new FLX2010 SMD pick+place from ESSEMTEC offers the most flexible

ESSEMTEC AG

Plenty of Interest in DEK Launch Webinar. Don’t miss it!

Industry News | 2010-09-20 19:43:37.0

Registrations for the webinar launch of DEK’s new ProActiv technology are escalating. With just over a week to go, keen interest is being shown by hundreds of participants signing up from Europe, Asia and the Americas.

ASM Assembly Systems (DEK)

Different Techniques for Plating

Industry News | 2018-10-18 11:08:03.0

Different Techniques for Plating

Flason Electronic Co.,limited

DEK and PacTech Join Forces for High-Volume Wafer Bumping Solution

Industry News | 2003-06-13 10:10:58.0

By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.

ASM Assembly Systems (DEK)

Manncorp's 6,400 CPH dual-head MC-392 pick-and-place features ball screw X-Y and 30um, 3 sigma accuracy

Industry News | 2010-12-01 13:36:54.0

Although all five models in Manncorp’s latest-generation MC series pick-and-place systems have received industry acclaim, one system in particular has stood out for its extraordinary price/performance ratio, according to CEO Henry Mann.

Manncorp

Manncorp P&P Assembles 4-Foot-Long LED Light Panels

Industry News | 2011-03-28 13:38:37.0

The continued popularity of LEDs – most notably in automobiles, energy-conserving lighting and consumer electronics – has caused Manncorp to roll out another LED-enabled pick and place system. The MC-392LED, according to CEO Henry Mann, "has features that will win approval from traditional SMD assemblers as well as those who mount diodes."

Manncorp

ECT's Contact Solutions to Showcase ZIP® Family at BiTS™ Burn-In & Test Socket Workshop

Industry News | 2012-02-10 16:30:05.0

Everett Charles Technologies’ (ECT) Contact Solutions will highlight the ZIP® family at the upcoming Burn-In & Test Strategies Workshop.

Everett Charles Technologies

Discover Europlacer’s Full Line Configuration at APEX

Industry News | 2016-02-18 19:44:14.0

Europlacer will demonstrate its full line configuration, representing unparalleled flexibility and value. Core to the configuration is the ability to manage the entire SMT line without compromise.

EUROPLACER

Indium Corporation Expert to Present at iNEMI Seminar Hosted by Zestron Europe

Industry News | 2024-01-29 11:14:41.0

Indium Corporation Regional Technical Manager and Technologist – Advanced Applications Andreas Karch will present at iNEMI's upcoming seminar, Humidity Robustness and Isolation Coordination for e-Mobility. The seminar, hosted by ZESTRON Europe, will be held on February 1 in Ingolstadt, Germany.

Indium Corporation


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