Industry News | 2018-10-15 18:31:07.0
Practical Components announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 – 15th Annual International Wafer-Level Packaging Conference. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The event will take place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose in San Jose, CA.
Industry News | 2024-09-30 19:54:13.0
Altus Group has introduced an advanced BGA re-balling solution to address the electronics industry's growing focus on sustainability and cost-efficiency. Developed by their pre-eminent supplier, Essemtec, this innovative process offers manufacturers a new approach to component recovery and reuse, aligning with increasing market demands for environmentally conscious practices.
Industry News | 2004-09-29 21:38:11.0
Frenchtown, NJ, September 2004
Industry News | 2011-03-28 11:42:40.0
Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced the immediate availability of three new low cost I/O Breakout Boards: the MachXO™ 2280 Breakout Board, the ispMACH® 4256ZE Breakout Board and the Power Manager II POWR1014A Breakout Board.
Industry News | 2010-07-29 15:10:06.0
Universal Instruments’ Advanced Process Lab hosted the first Advanced Research in Electronics Assembly (AREA) Consortium meeting of 2010 at the Treadway Inn in Owego, NY on June 16-17. Nearly 80 attendees from the 29 member companies participated in the two-day event, which will also be presented in subsequent webcasts. Topics ranged from thermal interface assembly to a continuing analysis of lead-free solder microstructure and reliability.
Industry News | 2013-09-16 14:38:01.0
VJ Electronix, Inc. and BEST, Inc. announce that Don Naugler and Bob Wetterman will be presenting a paper during technical session SMT3 BGA Profiling and Reballing at the upcoming SMTA International in Fort Worth, TX.
Industry News | 2008-04-07 21:16:55.0
FINETECH announces that it will display the FINEPLACER� CRS7.MD system at the upcoming NEPCON China 2008 trade show and exhibition, scheduled to take place April 8 to 11, 2008, in Shanghai, China.
Industry News | 2011-10-25 00:20:06.0
Multitest will exhibit its leading test solutions at the upcoming SV Test Conference
Industry News | 2008-04-07 22:56:56.0
Pomona, CA - Everett Charles Technologies (ECT) Semiconductor Test Group (STG) announces that its Gemini Kelvin spring probe was awarded a NPI Award in the category of Test & Inspection � ICT. The award was presented to the company during a Monday, March 31, 2008 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2008.
Everett Charles Technologies (acquired by LTX-Credence, which was acquired by Cohu)
Industry News | 2008-04-08 01:21:01.0
Pomona, CA - Everett Charles Technologies (ECT) Semiconductor Test Group (STG) announces that its Gemini Kelvin spring probe was named as a first finalist in the category of Testing during the VISION Awards announcement ceremony that took place Wednesday, April 2, 2008 in Las Vegas during APEX 2008.
Everett Charles Technologies (acquired by LTX-Credence, which was acquired by Cohu)
