Industry News: 0.4mm ptich bga (Page 1 of 3)

SMTA China Presents Awards at SMTA China East 2010 Conference/Nepcon China 2010

Industry News | 2010-04-30 18:47:15.0

SMTA China announces that it presented awards for the 10 best papers/presentations and two best exhibits at the SMTA China East 2010 Conference Award Presentation Ceremony, held on Wednesday, April 21, 2010 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Annual Breakfast Reception.

Surface Mount Technology Association (SMTA)

The Design Principles of Stencil Apertures

Industry News | 2018-10-18 10:24:05.0

The Design Principles of Stencil Apertures

Flason Electronic Co.,limited

IPC APEX India Technical Conference to Highlight Pathways for Growth in the India Electronics Manufacturing Future

Industry News | 2013-07-17 19:05:42.0

IPC — Association Connecting Electronics Industries® will host IPC APEX India™ on 26–29 August 2013 at the NIMHANS Convention Centre in Bangalore, India.

Association Connecting Electronics Industries (IPC)

IPC APEX India Technical Conference to Highlight Pathways for Growth in the India Electronics Manufacturing Future

Industry News | 2013-07-19 11:33:18.0

IPC — Association Connecting Electronics Industries® will host IPC APEX India™ on 26–29 August 2013 at the NIMHANS Convention Centre in Bangalore, India.

Association Connecting Electronics Industries (IPC)

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

Elastomer Socket for Infineon's BGA221

Industry News | 2011-03-11 14:47:03.0

Ironwood Electronics has recently introduced a new high performance BGA socket for 0.4mm pitch 221 ball BGA - SG-BGA7162. The socket operates at bandwidths up to 10 GHz with less than 1dB of insertion loss.

Ironwood Electronics

New Underfill from Zymet for 0.4-mm pitch POP's

Industry News | 2012-01-13 13:20:53.0

Zymet has introduced a new reworkable underfill encapsulant, CN-1736, designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility, making it suitable for use with a broader range of solderpastes and tacky fluxes.

Zymet, Inc

GHz Bandwidth Socket for Dual WLCSP

Industry News | 2011-02-26 14:35:16.0

Ironwood Electronics has recently introduced a new high performance WLCSP socket for 0.5mm pitch 40 ball WLCSP and 0.4mm pitch 30 ball WLCSP accommodated in the same socket.

Ironwood Electronics

Test Interface Boards – Customers Appreciate Multitest Pulse Plating Process for Board Fab

Industry News | 2012-08-20 13:00:35.0

Multitest, announces that its Pulse Plating Process provides significant advantages in terms of fabrication cost and cycle time.

Multitest Elektronische Systeme GmbH

Test Interface Boards – Customers Appreciate Multitest Pulse Plating Process for Board Fab

Industry News | 2012-08-20 13:01:17.0

Multitest, announces that its Pulse Plating Process provides significant advantages in terms of fabrication cost and cycle time.

Multitest Elektronische Systeme GmbH

  1 2 3 Next

0.4mm ptich bga searches for Companies, Equipment, Machines, Suppliers & Information

Software for SMT

World's Best Reflow Oven Customizable for Unique Applications
SMT feeders

High Precision Fluid Dispensers
Circuit Board, PCB Assembly & electronics manufacturing service provider

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Win Source Online Electronic parts

Best Reflow Oven