Industry News: 0.5 (Page 14 of 33)

New Vishay Proximity Sensor with a Vertical-cavity Surface-Emitting Laser (VCSEL) released by New Yorker Electronics

Industry News | 2021-05-11 15:00:29.0

New Vishay Proximity Sensor designed for High Performance in Consumer and Industrial Applications

New Yorker Electronics

Solderstar to Launch a Unique Zero Set-Up Datalogger at Productronica

Industry News | 2021-12-03 07:22:29.0

Clearwater, Florida: Productronica will be used as the launch pad for Solderstar's game-changing new datalogger, SLX. The innovative thermal profiler has been designed for operation with zero measurement setup, so it is instantly ready to use making the process of data capture quick and easy. As a leading supplier of temperature profiling equipment for reflow, wave, vapor and selective soldering, Solderstar will introduce the new product at their booth A4.240 during the exhibition held from 16-19 November, 2021 in Munich, Germany.

Solderstar

Laser Bar Bonding with AuSn or Indium on the New Automatic Sub-Micron Bonder FINEPLACER� FEMTO

Industry News | 2007-11-27 12:28:45.0

FINEPLACER� FEMTO, introduced in beginning of 2007, is now optimized for one of the most sophisticated bonding application. Due to the high process flexibility the FEMTO can handle both laser bar processes AuSn and Indium.

Finetech

Practical Dummy Components Announces Its Latest PoP Body Size

Industry News | 2008-06-19 11:14:35.0

LOS ALAMITOS, CA � June 18, 2008 � Practical Components Inc., the leading supplier of dummy components, announces that in cases where only its mechanical characteristics are required, Practical Dummy Components can be used instead of live, functioning components. Because there is no expensive die inside the package, the cost for performing mechanical testing is significantly lower.

Practical Components, Inc.

Air Bearing Performance Without Air Bearings!

Industry News | 2008-07-31 15:42:27.0

New Product/Design Engineering/OEM Manufacturing

Steinmeyer, Inc

FINETECH to Showcase Chip-to-Wafer Packaging with Sub-Micron Bonder at Photonics West 2009

Industry News | 2009-01-16 17:14:22.0

FINETECH will showcase chip-to-wafer bonding with the sub-micron placement accuracy FINEPLACER� Femto at the upcoming Photonics West exhibition (booth 519) in San Jose, CA, January 27-29, 2009

Finetech

Fine Line Stencil to Premier UltraSlic FG Solder Paste Stencil at APEX 2009

Industry News | 2009-03-18 14:23:09.0

Fine Line Stencil will introduce the UltraSlic™ FG solder paste stencil, which sets new stencil performance standards, in booth 846 at the upcoming APEX 2009 exhibition & conference, scheduled to take place March 31-April 2, 2009 in Las Vegas.

Fine Line Stencil, Inc.

EasySpheres Features Kester’s 959T No-Clean Halide-Free Flux Pen®

Industry News | 2009-07-16 14:35:03.0

POWAY, CA — July 2009 — EasySpheres LLC features Kester’s 959T no-clean, non-corrosive, halide-free Flux Pen®.

EasySpheres LLC

FCT Assembly’s UltraSlic FG Solder Paste Stencil Wins a 2009 Global Technology Award

Industry News | 2009-11-11 12:24:44.0

GREELEY, CO —FCT Assembly announces that it has been awarded a Global Technology Award in the category of Printing Equipment for its UltraSlic™ FG solder paste stencil. The award was presented to the company during a Tuesday, November 10, 2009 ceremony that took place at the New Munich Trade Fair Center in Munich, Germany.

FCT ASSEMBLY, INC.

Everett Charles Technologies’ Gary St. Onge to Present at APEX 2010

Industry News | 2010-03-26 23:28:15.0

Everett Charles Technologies announces that Gary St. Onge, Director of US and China Operations, will present a paper titled "Zoom Fixtures for ATE" at the upcoming IPC/APEX conference and exhibition.

Everett Charles Technologies


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