Industry News | 2016-10-16 19:10:53.0
Pickering Electronics will be showcasing its latest high density range at the International Test Conference on booth 216, 15 – 17 November 2016.
Industry News | 2016-11-14 19:11:37.0
Pickering Electronics, a leading provider of Reed Relays, will be showcasing its latest high density range at the International Test Conference on booth 216, 15 – 17 November 2016.
Industry News | 2020-12-18 11:15:50.0
New Excel Cell Electronic ZIF Type Board-to-FPC Connectors are used in Medical Ventilators, Computers, and Security Applications
Industry News | 2024-03-19 15:08:02.0
Custom designed garage for 2 Europlacer SMT Feeder Carts , No need to remove reels for controlled dry storage , saves floor time ! .
Industry News | 2008-04-07 21:09:26.0
FINETECH announces that it will display the FINEPLACER� Lambda system at the upcoming NEPCON China 2008 trade show and exhibition, scheduled to take place April 8 to 11, 2008, in Shanghai, China. This high precision bonder provides a placement accuracy of � 0.5 micron.
Industry News | 2009-03-06 15:54:16.0
OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces SN100C high ductility lead-free solder provides high impact strength. A high ductility solder alloy can absorb more energy during impact than an alloy with high tensile strength but is brittle.
Industry News | 2016-02-25 14:29:00.0
SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.
Industry News | 2016-05-31 20:58:06.0
SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.
Industry News | 2019-08-27 22:37:27.0
PVA announced that its distributor Maxim SMT will exhibit in Stand PE01 at productronica India. The company will showcase the Delta 8 four-axis conformal coating machine with a FCS300-ES and FC100.
Industry News | 2022-09-16 17:11:00.0
VPG Foil Resistors Line of 2-Terminal Power Resistors Provide Low Resistance Values and Improved TCR under High Stress Conditions
