Industry News: 0.5 mm thick ness board reflow (Page 3 of 6)

NOTE UK leading the way in Package on Package through Siplace technology

Industry News | 2010-06-23 11:36:12.0

Siplace presented a solution to NOTE satisfying their wide ranging needs

Siemens Process Industries and Drives

Christopher Associates' Jasbir Bath to Chair Reflow Assembly Session at IPC APEX EXPO

Industry News | 2011-03-14 17:53:00.0

Christopher Associates announces that Jasbir Bath, Consulting Engineer, will Chair the session titled "Reflow Assembly" at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas. The session will take place Tuesday, April 12, 2011 from 1:30-3 p.m.

Christopher Associates Inc.

Achieve Optimal Uniformity with BTU's TrueFlat Technology at SEMICON Taiwan

Industry News | 2023-09-04 14:03:03.0

BTU International, Inc. will highlight its TrueFlat™ reflow oven technology at SEMICON Taiwan in booth #M1039. The expo is scheduled to take place September 6-8, 2023 at TaiNEX 1 & 2 in Taipei.

BTU International

New Yorker Electronics Introduces New Family of ECE Flex Cable Connectors

Industry News | 2020-12-18 11:15:50.0

New Excel Cell Electronic ZIF Type Board-to-FPC Connectors are used in Medical Ventilators, Computers, and Security Applications

New Yorker Electronics

Ersa to Introduce XL Rework and Selective at APEX

Industry News | 2019-01-03 20:11:46.0

Kurtz Ersa will exhibit at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29-31, 2019 at the San Diego Convention Center in CA. The company will introduce the HR 600 XL and the VERSAFLOW 4XL with VERSAFLEX in Booth #2706.

kurtz ersa Corporation

Viscom will be Introducing the X7055 at the SMT 2003

Industry News | 2003-04-10 09:31:04.0

Combined AOI/AXI now also available with 4M megapixel technology for maximum throughput

Viscom AG

Ball Grid Array (BGA) Package

Industry News | 2018-12-08 03:31:22.0

Ball Grid Array (BGA) Package

Flason Electronic Co.,limited

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

BTU to Demo TrueFlat Technology for Substrate Flatness at SEMICON China

Industry News | 2018-02-19 13:46:00.0

BTU International will demonstrate its TrueFlat technology in the CohPros International Co., Ltd, booth #N2, 2613 at SEMICON China, scheduled to take place March 14-16, 2018 at the Shanghai New International Expo Centre.

BTU International

Working with QFNs and QFPs

Industry News | 2018-10-18 09:05:06.0

Working with QFNs and QFPs

Flason Electronic Co.,limited


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