Industry News: 0.80 (Page 1 of 2)

International Rectifier Introduces Bi-Directional Dual MOSFET in the FlipFET Package

Industry News | 2003-01-29 13:23:31.0

A Common Drain Configuration that is 80% Smaller than Devices in the TSSOP-8 Package

SMTnet

IPC Opens India Office and Electronics Manufacturing Training Facility

Industry News | 2010-09-26 14:42:22.0

Extending its training and knowledge-based resources and services to Indian electronics manufacturing facilities on a local level, IPC — Association Connecting Electronics Industries® has opened its first office in India. Located in South Bangalore, close to the well-known Electronics City, IPC India, a wholly-owned subsidiary of IPC, will be under the leadership of Managing Director Mr. Akshinthala Vijayendra.

Association Connecting Electronics Industries (IPC)

FCT Assembly’s Development Chemist to Present during SMTAI Poster Sessions

Industry News | 2014-08-28 15:40:58.0

FCT Assembly announces that Development Chemist Brittney Nolan will present during the Poster Sessions at SMTA International. The presentation, entitled “The Impacts of the Environment on the Printability of Solder Paste,” will take place Tuesday, September 30, 2014 from 12-2 p.m. in the Exhibit Hall at the Donald Stephens Convention Center in Rosemont, IL.

FCT ASSEMBLY, INC.

New Yorker Electronics Releases Approved Medical Devices from Polytron

Industry News | 2020-11-26 12:26:33.0

Polytron Devices DC-DC and AC-DC Converters are 2MOPP, IEC 60601-1-certified for Medical Treatments

New Yorker Electronics

Aries' New Cost-Effective CSP/MicroBGA Test and Burn-In Socket

Industry News | 2003-07-08 09:09:15.0

Available for Devices Up to 13 mm2 with Speeds Up to 1 GHz

Aries Electronics Inc

Practical Components Adds Casio Micronics WLP Wafer Scale Technology to Dummy Component Lineup

Industry News | 2011-01-11 13:37:34.0

Practical Components has added the Casio Micronics WLP Wafer Chip Size Package (WLP) to its comprehensive line of dummy components. The WLP is a miniature package, suitable for installation in surface mount technology (SMT).

Practical Components, Inc.

ECT’s CPG to showcase the ZIP® family at SEMICON WEST

Industry News | 2011-06-13 17:22:02.0

Everett Charles Technologies’ (ECT) Contact Products Group (CPG) will showcase the latest additions to its ZIP® family of flat technology Pogo® pins in Booth #5670 in the North Hall at the upcoming SEMICON West, scheduled to take place July 12-14, 2011 at the Moscone Center in San Francisco. A new eight-page ZIP® Product Portfolio brochure also will be available at the ECT CPG booth.

Everett Charles Technologies

ECT’s CPG TO SHOWCASE THE ZIP® FAMILY AT THE INTERNATIONAL TEST CONFERENCE

Industry News | 2011-08-24 13:24:13.0

Everett Charles Technologies (ECT) Contact Products Group (CPG) will showcase the latest additions to its ZIP® family of “flat” technology Pogo® pins in booth 114 at the upcoming International Test Conference (ITC)

Everett Charles Technologies

Methode Electronics Inc. Press Release: Methode Electronics, Inc. Announces U.S. Restructuring

Industry News | 2008-01-28 23:09:31.0

Methode Electronics, Inc. (NYSE:MEI), today announced a restructuring at its U.S.-based automotive operations in Carthage and Golden, IL. It will also discontinue producing legacy electronic connector products in Rolling Meadows, IL.

Methode Electronics, Inc.

NEW RF CENTER PROBE TEST SOCKET FOR DEVICES

Industry News | 2004-09-29 21:38:11.0

Frenchtown, NJ, September 2004

Aries Electronics Inc

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