Industry News: 0.8mm (Page 1 of 3)

Three Sun Multilayer PCB Accommodates 0.5mm(�) Holes

Industry News | 2003-05-19 10:06:43.0

The PCB is available with a maximum panel size of 406-by-460mm and a minimum board thickness of 0.8mm.

SMTnet

International Rectifier Introduces Bi-Directional Dual MOSFET in the FlipFET Package

Industry News | 2003-01-29 13:23:31.0

A Common Drain Configuration that is 80% Smaller than Devices in the TSSOP-8 Package

SMTnet

Prototype and Debug 96 ball BGA with Ease

Industry News | 2011-02-14 16:05:28.0

Design engineers using 0.8mm pitch 96 position BGA ICs will be interested in the PA-BGA96C-Z-01 probing and prototyping adapter with GHz BGA socket from Ironwood Electronics. Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing clock driver IC's. The socket is constructed with high performance and low inductance elastomer contactor.

Ironwood Electronics

Carpenter Manufacturing Introduces Model 27E Magnet Wire Stripper

Industry News | 2009-04-08 16:05:30.0

Carpenter Manufacturing introduces the new Model 27E Magnet Wire Stripper, designed to strip magnet wire, coils and resistor leads to within 0.031" (0.8 mm) from the component body. The rotating slotted stripping removes the film insulation resulting in a neat, clean edge. Strip lengths with the stop rod installed are up to 0.625" (16 mm), or up to 2.87" (72 mm) with the stop rod removed.

Carpenter Manufacturing Co., Inc.

Metcal launches cost-effective solution to rework complex and small components

Industry News | 2014-07-21 14:01:52.0

Metcal announces the addition of the Solder Ball Placement Kit to its convection rework accessory range.

Metcal

New Yorker Electronics Releases Industry's First 4-Quadrant Silicon PIN Photodiode in SMD Package

Industry News | 2021-01-05 11:02:47.0

New Vishay K857PE 4-Quadrant Silicon PIN Photodiode Delivers Excellent Signal-to-Noise Ratio with Virtually No Tolerance between Segments

New Yorker Electronics

Multitest Experts to Present PCB Pad Wear Analysis Findings at BiTS 2011

Industry News | 2011-02-03 14:43:42.0

Multitest announces that Valts Treibergs, R&D Engineering Manager, and Chris Cuda, US Product Manager, will present "PCB Pad Wear Analysis at 0.4 mm Pitch ― the Story Continues…" at the upcoming Burn-in & Test Socket Workshop, scheduled to take place March 6-9, 2011 at the Hilton Phoenix East/Mesa Hotel in Mesa, AZ.

Multitest Elektronische Systeme GmbH

ECT’s CPG TO SHOWCASE THE ZIP® FAMILY AT THE INTERNATIONAL TEST CONFERENCE

Industry News | 2011-08-24 13:24:13.0

Everett Charles Technologies (ECT) Contact Products Group (CPG) will showcase the latest additions to its ZIP® family of “flat” technology Pogo® pins in booth 114 at the upcoming International Test Conference (ITC)

Everett Charles Technologies

atg/LM to Launch A5-A Probe System With Automation at Productronica 2007

Industry News | 2007-11-08 21:54:57.0

atg Luther & Maelzer GmbH announces it will launch the new A5-A Probe System with Automation in Stand 341, Hall B4 at Productronica 2007. The Productronica exhibition and conference is scheduled to take place November 13-16, 2007 at the Munich Trade Fair Center in Munich, Germany.

Everett Charles Technologies

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