Industry News | 2018-09-04 10:25:16.0
Seoul, South Korea – Flexible SMT production has entered into a new dimension. Koh Young Technology’s 3D SPI (Solder Paste Inspection) system has now expanded its solution to perform complex dispensing. Koh Young highlighted the latest innovations, including its new high-precision, integrated dispenser for the KY8030-3 3D SPI in Stand 1F45 at NEPCON South China, which occurred August 28-30, 2018 in Shenzhen, China.
Industry News | 2008-07-18 11:10:08.0
Samsung and Dynatech Technology have added the Samsung Stencil Printer SMP400 to the American Competiveness Institutes EMPF Demonstration Factory. The six-sigma capable printer joins the Samsung SM421 Advanced Flexible Mounter with STF100S Zero-Impact Side Tray Feeder, a complete IT feeder system with an offline programming station and IT Mobile Workstation.
Industry News | 2010-03-22 14:13:32.0
MINNEAPOLIS - CyberOptics Corporation (Nasdaq: CYBE) announces that it will feature its latest inspection equipment in booth 2271 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Industry News | 2010-05-26 13:33:03.0
MINNEAPOLIS - CyberOptics Corporation (Nasdaq: CYBE), a leading SMT inspection solutions provider, announces that it will highlight its QX500™, SE350™ and SE500™ in booth 3D-03 at the upcoming JISSO PROTEC exhibition, which is scheduled to take place June 2-4, 2010 at the Tokyo Big Sight in Japan.
Industry News | 2012-06-27 14:07:07.0
PRIDE Industries, Inc has purchased two SE500™ 3-D Solder Paste Inspection (SPI) systems for its manufacturing facility in Roseville, CA.
Industry News | 2009-03-10 18:41:17.0
MINNEAPOLIS - January 2009 - CyberOptics Corporation (Nasdaq: CYBE) announces that it will introduce SE500, an advanced 100 percent 3-D solder paste inspection system, in booth 2071 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009 in Las Vegas.
Industry News | 2015-09-23 16:47:32.0
Viscom announced today that its S3088 SPI system will be featured in the SMTA International – National Physical Laboratory (NPL) Defect Database Live Solder Paste and Solder Joint Automatic Inspection Experience from Sept. 29-30, 2015 on the show floor. This year's special feature area will include live printing ultra-fine pitch deposits, 0201 and 01005 devices, inspection and measurement of different combinations of materials, plus some of the key in-process inspection steps to make a process perform correctly.
Industry News | 2013-01-17 16:15:15.0
PARMI will exhibit in booth #1527 at the IPC APEX EXPO.
Industry News | 2013-02-25 16:05:16.0
PARMI announces that it has been awarded a 2013 NPI Award in the category of Test & Inspection – SPI for its SPI HS70 Series.
Industry News | 2011-10-07 22:49:53.0
Deltec Automotive GmbH & Co. KG, based in Furth im Wald, has selected Viscom’s 3-D solder paste inspection system.
.png)
