Industry News | 2009-01-30 18:39:51.0
S-series tape feeders have been one of the most important components of many Siplace placement machines for many years. With its new 3x8 mm shutterless S-feeder, Siemens Electronics Assembly Systems (SEAS) now presents another improved version in the series. Fewer movable parts mean longer life and more reliability. The new feeder also handles a broader spectrum of components and makes the user's job easier. As a special benefit, owners of classic 3x8 mm feeders can have them upgraded to the shutterless version.
Industry News | 2001-02-20 15:33:50.0
Vitronics Soltec officially introduced its "5 Steps" program to successful lead-free soldering implementation at APEX 2001, and kicked off its European Advanced Technology Tour to bring the company's message and method to the world. The "5 Steps" is a step by step program developed by Vitronics Soltec's Technology Group and proven successful in multiple production manufacturing environments.
Industry News | 2010-04-10 23:59:50.0
LOS ALAMITOS, CA - Following the success of their 2007 test board and kit, Practical Components and Aim Solder have updated their offering with a new AIM print test board and kit that is designed to include many printing challenges commonly found in manufacturers' assemblies.
Industry News | 2014-03-26 08:42:22.0
Essemtecannounces that it has been awarded a 2014 NPI Award in the category of Component Placement – Multi-function for its multi-functional SMT Center.
Industry News | 2014-04-27 12:35:05.0
Essemtec announces that it has been awarded a 2014 EM Asia Innovation Award in the category of Pick-and-Place Systems (Multi-function) for its multi-functional SMT Center.
Industry News | 2014-04-27 12:37:06.0
Essemtec announces that it has been awarded a 2014 EM Asia Innovation Award in the category of Pick-and-Place Systems (Multi-function) for its multi-functional SMT Center.
Industry News | 2014-08-27 21:41:51.0
Essemtec announces that it will highlight the Paraquda 2 with integrated solder paste jet printer in Booth #640 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.
Industry News | 2015-01-07 10:19:54.0
Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, will exhibit in Booth #1211 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Company representatives will demonstrate the multi-functional SMT center Paraquda, Cubus SMT storage device and the new Lynx highly flexible and accurate pick-and-place system.
Industry News | 2015-01-22 17:40:23.0
Essemtec will exhibit in Booth #1211 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Company representatives will demonstrate the multi-functional SMT center Paraquda, Cubus SMT storage device and the new Lynx highly flexible and accurate pick-and-place system.
Industry News | 2015-05-12 16:59:43.0
Essemtec today announced that it will participate in ACI Technologies’ second annual Tech Expo, scheduled to take place May 20-21, 2015 at its facility in Philadelphia, PA. Steve Pollock, Vice President of Essemtec USA, will demonstrate the Paraquda G2, Cubus and Lynx on the factory floor.
