Industry News: 0201 component overlap (Page 6 of 33)

IPC Issues Call for Participation for 2014 IPC APEX EXPO

Industry News | 2013-04-03 18:46:12.0

IPC – Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders to submit abstracts for the 2014 IPC APEX EXPO® at the Mandalay Bay Resort and Convention Center in Las Vegas.

Association Connecting Electronics Industries (IPC)

Call for Participation Issued for IPC Printed Circuits Expo/APEX Joint Technical Conference

Industry News | 2003-05-01 08:15:48.0

Will take place February 23-27, 2004, at the Anaheim Convention Center in Anaheim, Calif.

Association Connecting Electronics Industries (IPC)

I.C.T Automated Optical Inspection (AOI) to Improve SMT Line Efficiency

Industry News | 2022-10-12 08:07:17.0

I.C.T Provide SMT Production Line solutions with Automated Optical Inspection (AOI) AOI is short for Automated Optical Inspection, which is widely used in the electronics industry to check the appearance of PCBA assembly at the back end of the circuit board assembly line. The basic principle of AOI is to judge whether the object to be tested meets the standard by comparing whether there is a large difference between the object to be tested and the standard image by using image technology. AOI emits a 4-color light source to the PCBA board, which is automatically scanned by an industrial camera for catastrophic failures, such as missing components or quality defects. Therefore, the quality of AOI depends on the image imaging ability, algorithm parsing ability and image discrimination technology. I.C.T AOI has done well in these aspects.

Dongguan Intercontinental Technology Co., Ltd.

New 0201 PCB Test Board

Industry News | 2002-07-12 18:39:53.0

Practical Components

Practical Components, Inc.

Fuji NXT III now supports the new 0201 mm (008004") components

Industry News | 2014-12-17 19:57:30.0

Fuji's Scalable Placement Platform NXT III now supports 0201 mm (0.25 x 0.125 mm, 008004") components as standard. By loading the newly developed H24G head on the NXT III, 0201 mm (0.25 x 0.125 mm, 008004") components can be supported without any change to the specifications of the machine (speed: 35,000 cph, accuracy: ±25 μm). The Intelligent Part Sensor (IPS), which checks the orientation of parts on the nozzle and ensures that the part does not remain on the nozzle after placement, is standard on the H24G placement head.

FUJI CORPORATION

SIPLACE 3x8 mm shutterless S-feeder improves component supply

Industry News | 2009-01-30 18:39:51.0

S-series tape feeders have been one of the most important components of many Siplace placement machines for many years. With its new 3x8 mm shutterless S-feeder, Siemens Electronics Assembly Systems (SEAS) now presents another improved version in the series. Fewer movable parts mean longer life and more reliability. The new feeder also handles a broader spectrum of components and makes the user's job easier. As a special benefit, owners of classic 3x8 mm feeders can have them upgraded to the shutterless version.

Siemens Process Industries and Drives

SMT Hautes Technologies Adds Advantis AC-90T, Augments Partnership with Universal

Industry News | 2012-04-10 15:19:51.0

SMT Hautes Technologies has further leveraged its alliance with Universal Instruments to enhance the company's capabilities and bolster its position as a leading-edge EMS provider. SMT Hautes has purchased an Advantis® AC-90T Platform for its Montreal, Canada production facility, extending its growing Universal Instruments surface mount production portfolio. The new high-speed machine is currently achieving 3X the throughput in half the footprint of the previous equipment set.

Universal Instruments Corporation

Universal Highlights New Platform and Emerging Market Focus at APEX 2012

Industry News | 2012-02-23 16:51:16.0

Universal Instruments sets a higher standard for versatility and performance in a multifunction surface mount platform with the introduction of the Genesis GX-37D to the Americas market at the APEX 2012. Universal will demonstrate the exceptional capabilities of the GX-37D on booth #2737, as well as share the company’s vision into the exciting new markets shaping the industry landscape and Universal’s unique position as a productivity and profitability leader in these markets.

Universal Instruments Corporation

Setup with SIPLACE SiCluster Professional: More efficient setups lead to higher productivity

Industry News | 2009-12-05 18:07:02.0

With its SIPLACE SiCluster Professional optimization software, Siemens Electronics Assembly Systems GmbH & Co.KG (SEAS) expands its wide-ranging portfolio of intelligent setup strategies for electronics manufacturing. In addition to combining products into setup families (clusters), SIPLACE SiCluster Professional is the first program that determines any component overlaps in these family setups. It groups these shared components on "constant component tables", which remain on the machine during setup changeovers, thus saving a significant amount of time.

Siemens Process Industries and Drives


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