Industry News: 0201 pillowing (Page 2 of 3)

IPC Extends Deadline on Call for Participation for IPC APEX EXPO 2018 Deadline for technical conference paper abstracts extended to: July 21, 2017

Industry News | 2017-07-17 18:33:56.0

IPC — Association Connecting Electronics Industries® has extended the deadline of their invitation for engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2018 to be held at the San Diego Convention Center. Professional development courses will take place February 25, 26 and March 1, 2018 and the technical conference will take place February 27–March 1, 2018. The extended deadline for technical conference abstracts is July 21, 2017.

Association Connecting Electronics Industries (IPC)

IPC Issues Call for Participation for IPC APEX EXPO 2019

Industry News | 2018-03-14 15:03:10.0

IPC — Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit technical conference abstracts and course proposals for IPC APEX EXPO 2019 to be held at the San Diego Convention Center. Professional development courses will take place January 27, 28 and 31, 2019 and the technical conference will take place January 29–31, 2019.

Association Connecting Electronics Industries (IPC)

IPC Extends Deadline on Call for Participation for IPC APEX EXPO 2019 Deadline for technical conference paper abstracts extended to: June 29, 2018

Industry News | 2018-06-20 20:36:50.0

IPC — Association Connecting Electronics Industries® has extended the deadline of their invitation for engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2019 to be held at the San Diego Convention Center. The technical conference will take place January 29–31, 2019. The extended deadline for technical conference abstracts is June 29, 2018.

Association Connecting Electronics Industries (IPC)

IPC Issues Call for Participation for IPC APEX EXPO 2020

Industry News | 2019-02-18 17:18:54.0

IPC — Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2020 to be held at the San Diego Convention Center. Professional development courses will take place February 2, 3 and 6, 2020 and the technical conference will take place February 4–6, 2020.

Association Connecting Electronics Industries (IPC)

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2020 in San Diego

Industry News | 2019-09-10 13:25:11.0

IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 5, 2020, and will be displayed throughout the event, offering additional visibility.

Association Connecting Electronics Industries (IPC)

IPC Issues Call for Participation for IPC APEX EXPO 2021

Industry News | 2020-03-08 16:23:52.0

IPC invites engineers, researchers, academics, technical experts and industry leaders to submit technical conference abstracts and course proposals for IPC APEX EXPO 2021 to be held at the San Diego Convention Center. Professional development courses will be held January 23-28, and the technical conference will take place January 26-28, 2021.

Association Connecting Electronics Industries (IPC)

Cobar Solder Products to Launch Alpine OT2 Solder Paste at SMTAI 2011

Industry News | 2011-10-16 01:00:33.0

Cobar Solder Products will introduce its new halogen- and halide-free solder paste, Alpine OT2 in Booth #314 at the upcoming SMTA International Conference & Exhibition

Cobar Solder Products Inc.

Indium Corporation Features New Halogen-Free Pb-Free Solder Paste at APEX

Industry News | 2009-02-11 23:22:16.0

ndium8.9HF Solder Paste is a halogen-free Pb-free solder paste with unsurpassed print transfer efficiency and response-to-pause printing. The advanced rheology of Indium8.9HF is ideally suited for today's advanced 0.4mm pitch and 0201 technologies.

Indium Corporation

Cobar Solder Products to Showcase Cobar OT2 Solder Paste at the IPC APEX Expo for the First Time

Industry News | 2012-01-17 16:11:55.0

Cobar Solder Products will introduce its new Halogen and Halide Free Solder Paste, Cobar OT2, in Booth #1709 at the upcoming IPC APEX Expo, scheduled to take place February 28 - March 1, 2012 at the San Diego Convention Center in California.

Cobar Solder Products Inc.

Saki America Demonstrates New Inspection Systems and Software at IPC APEX Booth 2025

Industry News | 2020-02-01 05:00:45.0

New 3D AOI/SPI Combo, 3D AXI system for PCBAs and M2M Software

SAKI America

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