Industry News | 2018-05-28 21:09:28.0
Seoul, South Korea – Koh Young Technology will exhibit “True 3D Smart Factory solutions powered by the AI platform” in booth 4C-20 at the upcoming JPCA show scheduled for June 6-8, 2018 at the Tokyo Big Sight in Japan. The company will highlight the high-speed Zenith UHS 3D AOI, KY8030-3 3D SPI, as well as comprehensive KSMART Industry 4.0 solution
Industry News | 2018-10-18 08:21:10.0
How to Prevent Non-Wetting Defect during the SMT Reflow Process
Industry News | 2010-04-28 21:43:42.0
Following a successful evaluation period, DEK’s ProFlow® ATx enclosed print head technology has been adopted by a high profile electronics company due to its ability to meet complex mass production requirements. As specialists in design, production and product management, the electronics solutions company had strict evaluation criteria that the DEK system successfully met and even, in some cases, exceeded.
Industry News | 2021-10-11 08:08:21.0
Koh Young, the industry leader in True3D™ measurement-based inspection solutions, announces the release of its new Meister D+ semiconductor inspection solution. Premium True3D™ Inspection Solution for Chiplets and System-in-Package (SiP) devices including die and surface mount components. The new Meister D+ is an extension of the Meister product family that features solutions ranging from solder paste, printed bumps, and solder ball to small components like 0201Ms and highly reflective die.
Industry News | 2010-04-10 23:59:50.0
LOS ALAMITOS, CA - Following the success of their 2007 test board and kit, Practical Components and Aim Solder have updated their offering with a new AIM print test board and kit that is designed to include many printing challenges commonly found in manufacturers' assemblies.
Industry News | 2001-02-16 10:32:40.0
Juki Automation Systems has introduced the KE-2020, a high-speed flexible assembler designed to place small and odd shaped components, as well as standard components, at optimum speed. The KE-2020 is equipped with a high-speed four-nozzle head for placing components and has one fine-pitch placement head with one nozzle capable of placing 0201 components, micro BGAs, CSPs and other odd-shaped components.
Industry News | 2013-07-29 10:38:07.0
A picture is worth a thousand words so they say. So say it with photos
Industry News | 2015-08-26 17:27:45.0
Juki Automation Systems today announced that it will exhibit in Booth #718 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. JAS, Inc. will showcase several updated flexible solutions designed for both high-volume and high mix environments, including:
Industry News | 2017-03-06 05:20:47.0
For over 30 years we have been offering hands-On and theory workshops in all aspect of electronic assembly. From practical skills like manual soldering, component handling plus wiring and assembly to the most advanced area array, flip chip and laser soldering technology http://www.bobwillis.co.uk
Industry News | 2015-09-14 17:31:42.0
Nordson DAGE and Nordson YESTECH, divisions of Nordson Corporation are pleased to announce that their products will be featured in the SMTA International – National Physical Laboratory (NPL) Defect Database Live Solder Paste and Solder Joint Automatic Inspection Experience from Sept. 29-30, 2015 on the show floor of SMTAI. The experience is free to attend and is supported by CIRCUITS ASSEMBLY Magazine, SMTA and NPL.
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