Industry News | 2016-05-16 16:16:21.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity.
Industry News | 2012-07-25 10:17:38.0
AIM, will highlight its new NC259 Solder Paste
Industry News | 2012-09-13 14:02:26.0
AIMannounces that it will highlight its new NC259 Solder Paste in booth #401 at the upcoming SMTA International Conference and Expo,
Industry News | 2016-05-16 20:59:04.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 8 worldwide SHENMAO locations.
Industry News | 2016-07-02 06:40:16.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 8 worldwide SHENMAO locations.
Industry News | 2016-08-23 16:30:00.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, MBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.76, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 11 worldwide SHENMAO Technology locations.
Industry News | 2013-05-07 13:45:19.0
AIM Solder announces that NC259 Solder Paste is a low-cost, lead-free and halogen-free solder paste that offers superior performance comparable to that of tin/lead and high-silver lead-free solder pastes, a virtual drop-in for costly SAC305.
Industry News | 2018-10-17 20:06:14.0
Nathan Trotter announces that it was awarded a 2018 Global Technology Award in the category of Solder Bar for its SAC 305 Solder Bar. The award was presented to the company during a Tuesday, Oct. 16, 2018 ceremony that took place during SMTA International.
Industry News | 2018-11-16 19:02:38.0
Nathan Trotter announces that it was awarded a 2018 Mexico Technology Award in the category of Solder Bar for its SAC 305 Solder Bar. The award was presented to the company during a Wednesday, Nov. 14, 2018 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.
Industry News | 2021-11-03 21:49:10.0
The wheel speed sensor is used to test the wheel speed of a car. For modern vehicles, wheel speed is essential. The vehicle dynamic control (VDC) system, vehicle electronic stability program (ESP), anti-lock braking system (ABS) all require wheel speed information. So the wheel speed sensor is one of the most critical sensors in modern society. Considering the actual factors such as the working environment and the size of the wheel, the electro-magnetic induction sensor and hall type wheel speed sensor are mainly used.
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