Industry News | 2017-05-11 17:06:16.0
Library Expert Lite automatically builds footprints and 3D STEP models for tens of millions of parts, for free.
Industry News | 2010-04-10 23:59:50.0
LOS ALAMITOS, CA - Following the success of their 2007 test board and kit, Practical Components and Aim Solder have updated their offering with a new AIM print test board and kit that is designed to include many printing challenges commonly found in manufacturers' assemblies.
Industry News | 2018-10-18 08:34:52.0
How to Prevent Solder Bridging in 3528 PLCC6 RGB LEDs?
Industry News | 2012-04-09 13:45:59.0
As the electronics assembly industry evolves, printed circuit board (PCB) features and surface mount technology (SMT) components continue to get smaller and smaller. This miniaturization shrinks the process window at print, placement, and reflow, increasing the opportunities for defects.
Industry News | 2018-10-18 08:14:11.0
How to Prevent the Tombstone and Open Defects during the SMT Reflow Process
Industry News | 2011-03-31 12:07:21.0
JBC Tools announces that it will exhibit in Booth #2629 at the upcoming IPC APEX EXPO.
Industry News | 2011-05-16 15:56:59.0
JBC Tools announces that it will exhibit at the upcoming SMTA Oregon Symposium and Supplier Day, scheduled to take place Wednesday, May 18, 2011 at the Tektronix Building 38 Conference Center in Beaverton, OR.
Industry News | 2011-08-22 18:36:29.0
JBC Tools will feature its Nano Station in Booth #226 at the upcoming IPC Midwest Conference & Exhibition.
Industry News | 2011-09-21 14:12:49.0
JBC Tools will exhibit in Booth #609 at the upcoming SMTA International Conference & Exhibition.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
