Industry News: 0402 size (Page 4 of 6)

Fuji Expands Printer Line-up with NXTP-M35

Industry News | 2013-01-22 01:29:07.0

Fuji has released the NXTP M35 printer, which expands the supported panel size of this printer series to 350 x 300 mm (13.7 x 11.8 inches). The latest addition to the Fuji line-up has all the benefits of the previously released NXTP M25, but with a wider body for handling medium sized panels.

FUJI CORPORATION

Virtual Industries Debuts VSPT Series of Small Parts Tips

Industry News | 2008-07-30 23:24:03.0

COLORADO SPRINGS, CO � July 29, 2008 � Virtual Industries Inc., a leading supplier of manual vacuum handling solutions, introduces the VSPT0803 small part tip.

Virtual Industries, Inc.

SMT solder joint quality and appearance inspection process

Industry News | 2018-10-18 08:00:40.0

SMT solder joint quality and appearance inspection process

Flason Electronic Co.,limited

SMT solder joint quality and appearance inspection process

Industry News | 2018-10-18 08:01:00.0

SMT solder joint quality and appearance inspection process

Flason Electronic Co.,limited

Southwest Systems Technology, Inc. to Highlight Juki’s Leading Equipment at the CTEA Austin Expo & Tech Forum

Industry News | 2010-09-16 21:53:21.0

Southwest Systems Technology, Inc., the leading manufacturing resource for the Southwest, announces that it will highlight Juki Corporation’s latest product offerings at the upcoming Central Texas Electronics Association (SMTA/IMAPS) Expo & Tech Forum, scheduled to take place Thursday, October 7, 2010 at the Norris Conference Centers located at 2525 West Anderson Lane, Austin, Texas.

Southwest Systems Technology

Vicor Sees Improvement with DEK’s Nano-ProTek Stencil Coating

Industry News | 2011-06-24 18:52:10.0

Vicor Corporation, recently evaluated DEK’s award-winning Nano-ProTek stencil nano coating and has reported excellent results. On a densely populated board with multiple 0402, 0201, BGA and micro-BGA components, Nano-ProTek helped improve CpK and yield.

ASM Assembly Systems (DEK)

Koh Young SPI Dispenses Solder Paste for 0402M (01005) Microchips

Industry News | 2018-09-04 10:25:16.0

Seoul, South Korea – Flexible SMT production has entered into a new dimension. Koh Young Technology’s 3D SPI (Solder Paste Inspection) system has now expanded its solution to perform complex dispensing. Koh Young highlighted the latest innovations, including its new high-precision, integrated dispenser for the KY8030-3 3D SPI in Stand 1F45 at NEPCON South China, which occurred August 28-30, 2018 in Shenzhen, China.

Koh Young America, Inc.

Juki to Demonstrate Industry-Leading SMT Assembly Systems at SMTAI 2011

Industry News | 2011-09-19 16:58:41.0

Juki Automation Systems will exhibit its KE-1080 modular placement system and FlexSolder W510 in Booth #309 at the upcoming SMTA International Conference & Exhibition.

Juki Automation Systems

Fuji Announces NXT III

Industry News | 2013-05-13 01:37:26.0

Fuji Machine Mfg. Co., Ltd. is excited to announce the upcoming release of its newly developed NXT III mounting platform. The latest edition to the NXT series offers improved performance in all areas and continues the evolution of a machine which has now sold more than 40,000 modules all over the world, covering every imaginable production type and volume.

FUJI CORPORATION

Saki Demonstrates High Speed, High Resolution 2D and 3D AOI Systems at NEPCON China, Stand 1J25

Industry News | 2016-04-20 18:39:31.0

Saki Corporation will present its 2D and new 3rd generation 3D automated optical inspection (AOI) systems at NEPCON China 2016, held from April 26-28, at the Shanghai World Expo & Exhibition Center, in stand 1J25. Technical experts will be at the booth to discuss the factors to consider to determine the correct AOI system for specific inspection and measurement needs.

SAKI America


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