Industry News | 2013-06-25 11:29:47.0
Multitest, announces that Klaus Ruhmer will present at Test Vision 2020, in conjunction with SEMICON West, scheduled to take place July 10-11, 2013 at the San Francisco Marriott Marquis.
Industry News | 2016-10-06 09:52:01.0
Engineered Material Systems will exhibit at Semicon Europa, scheduled to take place Oct. 25-27, 2016 in Grenoble, France. Company representatives will showcase both liquid and dry-film negative photoresist for use in microfluidics, wafer level packaging and CMOS applications (TSV sealing/passivation). These material formulations have been optimized for spin coating (liquid) or hot roll lamination (dry film) and processing on MEMS and IC wafers.
Industry News | 2017-01-19 16:57:12.0
Ascentech will be exhibiting the latest innovative contamination testing, optical inspection, and other productivity-enhancing technology at IPC/APEX in San Diego. Ascentech will show the remarkable GEN3 CM22+, one of the company’s award-winning CM+ range of contaminometers. The CM+ Series measure the amount of ionic contamination in accordance with all existing test methods often referred to as ROSE testing as well as the new PICT test. The CM22+ is a freestanding system able to accommodate larger assemblies while maintaining a low surface area to test solution ratio.
Industry News | 2017-03-20 17:31:31.0
Engineered Material Systems is pleased to introduce the DF-35120 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer level packaging and CMOS applications (TSV sealing). The dry film is 120 µm thick. This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
Industry News | 2017-08-10 17:50:15.0
Engineered Material Systems is pleased to introduce the DF-3590 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
Industry News | 2017-09-13 14:24:45.0
Engineered Material Systems is pleased to announce plans to exhibit at MicroTAS, scheduled to take place Oct. 22-26, 2017 in Savannah, GA. The company will showcase both liquid and dry-film negative photoresists for use in microfluidics, wafer level packaging and CMOS applications (TSV sealing/passivation). These material formulations have been optimized for spin coating (liquid) or hot roll lamination (dry-film) and processing on MEMS and IC wafers.
Industry News | 2017-12-05 14:37:56.0
Engineered Material Systems announces the availability of 5 µm thick dry-film negative photoresists for use in micro-electro mechanical systems (MEMS), wafer level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll or vacuum lamination and processing on MEMS and IC wafers.
Industry News | 2019-03-05 18:02:49.0
Kurtz Ersa today announced plans to exhibit at the SMTA Dallas and Houston Expo & Tech Forums. The Dallas Expo is scheduled to take place Tuesday, March 19, 2019 at the Plano Event Stadium, and the Houston Expo will be held Thursday, March 21, 2019 at the Stafford Centre. Company representatives will discuss Ersa’s printing and reflow equipment.
Industry News | 2020-09-22 11:05:29.0
National Circuit Assembly has purchased and installed a PARMI HS60L 3D Solder Paste Inspection (SPI) system. With the most reliable and accurate 3D data, NCA offers reliable, accurate inspection.
Industry News | 2023-04-03 13:28:07.0
TAGARNO has developed a new 'how to' guide for implementing digital microscopes for soldering and PCB inspection. Magnification has been an integrated and crucial part of PCB production and rework for many years, and digital microscopes have taken PCB inspection to the next level.
