Industry News | 2003-04-01 08:48:49.0
Setting a New Standard in AOI PCB Inspection
Industry News | 2008-04-07 22:54:27.0
DORSET, UNITED KINGDOM - March 31, 2008 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it has been awarded The 2008 NPI Award in the category of Multifunction Pick-and-Place for its impressive iineo SMT platform. The award was presented to the company during a Monday, March 31, 2008 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2008.
Industry News | 2014-07-28 12:42:54.0
Viscom will present the most advanced and comprehensive SPI, AOI and X-ray portfolio on the market in Booth #A-1C36 at Nepcon South China. Viscom S3088 AOI and SPI systems are designed to flexibly cover even the most challenging requirements, from small series production to high-volume/low-mix. The new XM-3D camera module allows for especially fast inspections, with both high-resolution angled views and 3D analyses.
Industry News | 2012-02-15 19:12:30.0
Engineered Material Systems has released its new DA-5045-2 and DA-5045-4 High Thermal Conductivity Die Attach Adhesives for attaching light emitting diodes (LEDs) and small die.
Industry News | 2013-06-12 18:03:39.0
Engineered Material Systems, announces the debut of its 357-284 Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive for printer head and circuit assembly applications.
Industry News | 2013-06-24 10:34:13.0
Engineered Material Systems (EMS), debuts its CA-148 Jettable Conductive Adhesive for ribbon stringing and bussing in photovoltaic applications.
Industry News | 2016-10-04 19:16:23.0
Engineered Material Systems is pleased to debut its 640-35 (dam) and 640-46 (fill) dam and fill UV cured chip encapsulants for chip-on-board smart card applications.
Industry News | 2019-08-21 16:04:15.0
Seika Machinery plans to exhibit in Booth #410 at SMTA International. Seika will showcase the Tsuchiyama n=1 Checker FAI and Kyowa PCAS Software Series for PCB Measurement.
Industry News | 2013-05-22 14:12:24.0
Engineered Material Systems, Inc. (EMS) debuts its 535-18M-57 UV Cured Epoxy Adhesive formulated for microelectronic assembly applications.
