Industry News: 1

New Dry Film Negative Photoresist for MEMS and Wafer Level Packaging

Industry News | 2017-08-10 17:50:15.0

Engineered Material Systems is pleased to introduce the DF-3590 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Materials Systems, Inc.

Engineered Material Systems to Showcase Liquid and Dry Film Negative Tone Photoresists at MicroTAS

Industry News | 2017-09-13 14:24:45.0

Engineered Material Systems is pleased to announce plans to exhibit at MicroTAS, scheduled to take place Oct. 22-26, 2017 in Savannah, GA. The company will showcase both liquid and dry-film negative photoresists for use in microfluidics, wafer level packaging and CMOS applications (TSV sealing/passivation). These material formulations have been optimized for spin coating (liquid) or hot roll lamination (dry-film) and processing on MEMS and IC wafers.

Engineered Materials Systems, Inc.

Super Thin Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Industry News | 2017-12-05 14:37:56.0

Engineered Material Systems announces the availability of 5 µm thick dry-film negative photoresists for use in micro-electro mechanical systems (MEMS), wafer level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll or vacuum lamination and processing on MEMS and IC wafers.

Engineered Materials Systems, Inc.

Ersa heads to Texas for the SMTA Dallas and Houston Expos

Industry News | 2019-03-05 18:02:49.0

Kurtz Ersa today announced plans to exhibit at the SMTA Dallas and Houston Expo & Tech Forums. The Dallas Expo is scheduled to take place Tuesday, March 19, 2019 at the Plano Event Stadium, and the Houston Expo will be held Thursday, March 21, 2019 at the Stafford Centre. Company representatives will discuss Ersa’s printing and reflow equipment.

kurtz ersa Corporation

National Circuit Assembly Offers Authentic Measurement and Inspection with New 3D SPI System

Industry News | 2020-09-22 11:05:29.0

National Circuit Assembly has purchased and installed a PARMI HS60L 3D Solder Paste Inspection (SPI) system. With the most reliable and accurate 3D data, NCA offers reliable, accurate inspection.

National Circuit Assembly

New Guide 'How to use a digital microscope for soldering and PCB inspection'

Industry News | 2023-04-03 13:28:07.0

TAGARNO has developed a new 'how to' guide for implementing digital microscopes for soldering and PCB inspection. Magnification has been an integrated and crucial part of PCB production and rework for many years, and digital microscopes have taken PCB inspection to the next level.

Tagarno

Pemtron Explores Advanced AOI and Conformal Coating Solutions at SMTA Aguascalientes Expo

Industry News | 2023-05-30 07:00:23.0

Pemtron Technology is pleased to announce plans to exhibit at the SMTA Aguascalientes Expo and Tech Forum, scheduled to take place Thursday, June 1, 2023 at the Aguascalientes Marriott Hotel in Aguascalientes, Mexico.

Pemtron

Europlacer to Exhibit IINEO SMT Platform and XPii-II Pick-and-Place Unit at APEX 2010

Industry News | 2010-03-24 13:35:52.0

APEX, NC - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will display its IINEO SMT platform, along with its new XPii-II pick-and-place unit in booth 2259 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas, NV.

EUROPLACER

Essemtec to Increase Accuracy of Traceability Data Pick-and-place featuring integrated labeling and identification

Industry News | 2013-05-28 14:30:51.0

A traceability solution should be able to assign assembly data to products without any doubt. Many systems, however, are likely to fail if there is manual intervention. Essemtec has now invented the integrated PCB identification system that no longer can be bypassed.

ESSEMTEC AG

New High Thermal Conductivity LED Die Attach Adhesive for Small Die and LEDs from Engineered Material Systems

Industry News | 2013-09-05 20:26:22.0

Engineered Material Systems , a leading global supplier of electronic materials for circuit assembly applications debuts its CA-195 High Thermal Conductivity, Low Cost Electrically Conductive LED Die Attach Adhesive for attaching LED and other small semiconductor die to silver and copper lead frames.

Engineered Materials Systems, Inc.


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