Industry News | 2012-02-23 15:35:35.0
The SMTA Capital Chapter is pleased to announce the upcoming SMTA meeting. During this first meeting of 2012, Cleve Williams, an industry expert with more than 20 years of electronics manufacturing experience, will share his knowledge and expertise on AOI Solder Inspection.
Industry News | 2011-04-22 21:54:12.0
The Capital Chapter is announcing its next SMTA meeting to be held at APL, Johns Hopkins University, in Laurel MD on May 17, 2011 from 5pm-8pm.
Industry News | 2012-10-30 21:40:28.0
The SMTA Capital Chapter is pleased announce its upcoming meeting on November 8, 2012, from 5 pm until 8 pm at Zentech Manufacturing.
Industry News | 2021-10-28 11:55:04.0
IPC Releases PCB Industry Results for September 2021
Industry News | 2024-11-25 14:47:25.0
IPC releases EMS industry results for October 2024
Industry News | 2008-03-15 15:52:21.0
PEMBROKE, Bermuda, March 13 /PRNewswire-FirstCall/ -- Tyco Electronics Ltd. (NYSE: TEL)(BSX: TEL) today announced that its Board of Directors has authorized an increase in the company's share repurchase program to $1.25 billion from $750 million, and also has declared a regular quarterly cash dividend of $0.14 per common share. Through the end of February, the company had utilized $512 million of the $750 million share repurchase program originally authorized in September 2007.
Industry News | 2017-11-29 14:38:24.0
Transition Automation announces the introduction of a precision Permalex® Edge Squeegee for retrofitting Magna-Print® universal squeegee system holders. In response to requests from customers, Transition Automation developed a Permalex blade that includes a separate magnetic strip bonded to the rear side of the squeegee, enabling the Permalex squeegee to be quickly loaded and locked into the Magna-Print Holders.
Industry News | 2016-10-11 13:26:07.0
CAMI Research Inc. (Acton, MA) announces another new board for its CableEye cable and harness testing systems. Populated with solder pads to accept both aligned and staggered, 1.25mm and 1.5mm pitch, surface mount and through hole (TH) connectors, the board addresses any market with a demand for board-to-board connections. Rated to 700Vdc/500Vac, the CB51 may be used on all CableEye models.
Industry News | 2011-11-20 12:59:37.0
ACD has been awarded a Global Technology Award in the category of Contract services $1-25 million for its Flight Status Board Tracking System.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
