Industry News: 1/17 (Page 10 of 15)

Sharp Decline in European Electronics Manufacturing Jeopardizes Strategic EU Priorities

Industry News | 2024-06-17 12:34:59.0

Key segments of EU electronics manufacturing industry set to decline undermining Europe's security, industrial resiliency, and global competitiveness

Association Connecting Electronics Industries (IPC)

IPC PCB Executive Agent Task Force Optimistic About Efforts: Two Government Reports Recognize Vital Role of U.S. PCB Industry.

Industry News | 2010-03-27 19:03:08.0

BANNOCKBURN, Ill., USA, - Following a year of active engagement with Congress and Department of Defense (DoD) policy makers, IPC and the IPC PCB Executive Agent Task Force members' are pleased to see their efforts are having a noticeable effect. Two recently released reports from the DoD and the U.S. Commerce Department emphasize the government’s growing awareness of the importance of the U.S. printed circuit board industry in protecting national security.

Association Connecting Electronics Industries (IPC)

Innovative Technology Center at IPC APEX EXPO Highlights Leading Edge Technologies.

Industry News | 2010-03-27 19:26:29.0

BANNOCKBURN, Ill., USA, - IPC - Association Connecting Electronics Industries® announces the products that will be featured in the Innovative Technology Center (ITC) at IPC APEX EXPO™, April 6–8, 2010, in Las Vegas. Assessed by an IPC Review Board of industry experts, the products were selected based on their representation of a new or emerging technology of significant value and relevance to the electronics manufacturing industry.

Association Connecting Electronics Industries (IPC)

IPC Releases PCB Industry Results for February 2010

Industry News | 2010-03-27 19:35:44.0

BANNOCKBURN, Ill., USA, - IPC — Association Connecting Electronics Industries® announced today the February findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.

Association Connecting Electronics Industries (IPC)

Updates to IPC-6012 and IPC-A-600 Released: Five Years of New Board Technologies and Processes Bring Significant Changes to Specifications.

Industry News | 2010-04-10 02:09:54.0

If a picture is worth a thousand words, the new H revision of IPC-A-600, Acceptability of Printed Boards, is a priceless work of art for fabricators and assemblers, particularly inspectors and product developers. IPC — Association Connecting Electronics Industries® announces the new releases of IPC-A-600H and its companion document the C revision of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards.

Association Connecting Electronics Industries (IPC)

IPC RELEASES PCB INDUSTRY RESULTS FOR MARCH 2010

Industry News | 2010-04-27 10:34:23.0

BANNOCKBURN, Ill., USA — IPC — Association Connecting Electronics Industries® announced today the March findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.

Association Connecting Electronics Industries (IPC)

IPC Releases PCB Industry Results For April 2010

Industry News | 2010-05-30 16:23:14.0

BANNOCKBURN, Ill., USA — IPC — Association Connecting Electronics Industries® announced today the April findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.

Association Connecting Electronics Industries (IPC)

IPC RELEASES PCB INDUSTRY RESULTS FOR MAY 2010

Industry News | 2010-06-28 17:43:21.0

BANNOCKBURN, IL — IPC - Association Connecting Electronics Industries® announced today the May findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.

Association Connecting Electronics Industries (IPC)

IPC RELEASES NEW REVISION OF SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD

Industry News | 2010-07-22 22:37:02.0

IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.

Association Connecting Electronics Industries (IPC)


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