Industry News | 2018-08-29 19:32:05.0
omputrol today announced that it has invested in another Kulicke & Soffa/Assembléon AX-501 Pick-and-Place system. Additionally, the company added another iFlex H1 end-of-line solution from Kulicke & Soffa/Assembléon.
Industry News | 2018-09-11 12:21:33.0
The fanless 16-bit DG800/900 Series of arbitrary waveform generators provides stable, low-jitter signals to 100MHz with a variety of modulations
Industry News | 2016-09-22 17:41:20.0
Pickering Electronics will be showcasing its latest high density range at electronica on 8 – 11, November 2016 in booth B1.550.
Industry News | 2016-10-16 19:10:53.0
Pickering Electronics will be showcasing its latest high density range at the International Test Conference on booth 216, 15 – 17 November 2016.
Industry News | 2016-11-14 19:11:37.0
Pickering Electronics, a leading provider of Reed Relays, will be showcasing its latest high density range at the International Test Conference on booth 216, 15 – 17 November 2016.
Industry News | 2019-04-15 16:47:35.0
New model of LCR-Reader-MP on the horizon; updated model offers record high basic accuracy and unparalleled amount of test functions
Industry News | 2022-02-07 17:03:36.0
Sono-Tek Corporation (OTC BB: SOTK) is pleased to introduce a new ultrasonic coating system designed to spray EMI shielding silver inks, FlexiCoat EMI. This emerging market is a natural fit for Sono-Tek's ultrasonic spray technology. At a fraction of the cost of sputtering technology, Sono-Tek ultrasonic spray coating systems have been used as sputtering alternatives where cost savings is a significant concern during manufacturing. Sono-Tek coated EMI shielding components have comparable characteristics to sputtered parts both for adhesion and shielding properties.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2020-12-23 19:16:42.0
The VEML3328 and VEML3328 Sensors Detect Red, Green, Blue, Clear and IR Light in a Standard and Side-Looking Package
Industry News | 2018-11-29 16:33:25.0
USB 3.0 SuperSpeed Isolator eliminates ground loops and ground potential differences and is ideal for measurement, industrial, automotive and audio technology applications.
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