Industry News | 2018-09-11 19:30:04.0
Nihon Superior Co.has developed a new flux-cored solder wire that greatly reduces spatter compared with conventional cored wire. The new cored-flux, (032) allows the use of a wide range of soldering iron tip temperatures with very little spatter, even with high tip temperatures.
Industry News | 2018-10-18 10:24:05.0
The Design Principles of Stencil Apertures
Industry News | 2018-11-29 16:33:25.0
USB 3.0 SuperSpeed Isolator eliminates ground loops and ground potential differences and is ideal for measurement, industrial, automotive and audio technology applications.
Industry News | 2020-10-22 03:17:25.0
4 Questions to help you better understand the High and Low Temperature Chamber
Industry News | 2020-12-22 12:34:42.0
New Vishay Dale Inductor for Class D Amplifiers Offers High Operating Temperatures to +155°C in Compact 2525 Case Size while Delivering Low Distortion and Minimal Cross-Talk
Industry News | 2020-12-23 19:16:42.0
The VEML3328 and VEML3328 Sensors Detect Red, Green, Blue, Clear and IR Light in a Standard and Side-Looking Package
Industry News | 2021-02-03 09:05:21.0
New Gowanda Broadband Conical Configurations Designed to Enhance Utility in Electronics Design
Industry News | 2022-02-07 17:03:36.0
Sono-Tek Corporation (OTC BB: SOTK) is pleased to introduce a new ultrasonic coating system designed to spray EMI shielding silver inks, FlexiCoat EMI. This emerging market is a natural fit for Sono-Tek's ultrasonic spray technology. At a fraction of the cost of sputtering technology, Sono-Tek ultrasonic spray coating systems have been used as sputtering alternatives where cost savings is a significant concern during manufacturing. Sono-Tek coated EMI shielding components have comparable characteristics to sputtered parts both for adhesion and shielding properties.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2003-05-13 08:22:33.0
Revenues for the first quarter of 2003 totaled $54.2 million, compared to the $51.1 million recorded in the first quarter a year ago.
.png)