Industry News | 2014-04-15 07:48:16.0
Techcon Systems will exhibit in Booth #B-1E25 at NEPCON China 2014, scheduled to take place April 23-25, 2014 at the Shanghai World EXPO Exhibition & Convention Center.
Industry News | 2014-04-28 19:46:40.0
Techcon Systems will exhibit in distributor Krayden, Inc.’s booth 303 at the SMTA Atlanta 18th Annual Expo, which will take place on Wednesday, May 7, 2014 at the Gwinnett Civic Center in Duluth, GA.
Industry News | 2014-04-30 16:58:47.0
Techcon Systems will exhibit in distributor Krayden, Inc.’s booth 46 at the SMTA Michigan Expo & Tech Forum, which will take place on Tuesday, May 20, 2014 at the Doubletree Hotel in Holland, MI.
Industry News | 2014-04-30 16:59:59.0
Techcon Systems will exhibit in distributor Krayden, Inc.’s booth 46 at the SMTA Michigan Expo & Tech Forum, which will take place on Tuesday, May 20, 2014 at the Doubletree Hotel in Holland, MI.
Industry News | 2014-05-05 16:11:26.0
NEPCON China, the Asian electronics manufacturing industry’s most essential event, launched in Shanghai at the World EXPO Exhibition & Convention Center successfully.
Industry News | 2014-06-05 12:21:18.0
AI Technology introduces COOL-GUMPAD™ CGP7156, a new class of thermal interface material with extreme compressibility to fill in all uneven and unparallel thermal interface surfaces in LED luminaire modules, large area power modules and large area metal-core printed wiring board (MCPWB) applications.
Industry News | 2014-07-28 21:23:25.0
Techcon Systems, will exhibit in Booth #A-1K25 at NEPCON South China, scheduled to take place August 26-28, 2014 at the Shenzhen Convention & Exhibition Center.
Industry News | 2014-10-13 09:31:03.0
Techcon Systems announces that it will showcase its range of industry-leading dispensing solutions in Booth #344 at The ASSEMBLY Show from October 28-30, 2014 in Rosemont, IL.
Industry News | 2014-12-19 23:52:27.0
ADLINK Technology today announced the release of its latest workstation grade PICMG 1.3 System Host Board, the NuPRO-E72, supporting 4th generation Intel® Xeon® E3-1200 v3, Core i3, Pentium and Celeron processors in a LGA1150 package with DDR3 1600 memory up to 16GB with ECC support.
Industry News | 2017-01-24 17:10:51.0
At next month’s IPC APEX Expo (APEX) event in San Diego, California, Henkel Adhesive Technologies’ electronics business will display a full range of state-of-the-art electronic materials, all designed to push the conventional limits of performance capability. From February 14 through 16 in booth #1501, Henkel’s line of game-changing solder, encapsulant, underfill and thermal materials will be on show.
