Industry News: 1-mil (Page 2 of 2)

Polyonics to Debut New Technologies at SMTA Atlanta

Industry News | 2009-04-15 17:01:04.0

WESTMORELAND, N.H. � April 2009 � The leader in harsh environmental labels and product marking for industrial identification, Polyonics Inc. announces that it will debut several new technologies at the upcoming 13th Annual Atlanta Expo, scheduled to take place Thursday, April 16, 2009 at the Gwinnett Civic Center in Duluth, GA.

Polyonics, Inc.

Kyzen's Rich Brooks Holds Successful Presentation at SMTA Silicon Valley Chapter Meeting

Industry News | 2010-04-28 20:24:38.0

NASHVILLE — Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Rich Brooks held a successful presentation at the SMTA Silicon Valley Chapter meeting, which took place on Thursday, April 22, 2010 from 3-5:30 p.m. at EET, Inc. in Reno, NV.

KYZEN Corporation

High-Precision, High-Mix, Print-Place-Reflow Package Under $47K

Industry News | 2014-01-30 17:35:39.0

Manncorp has recently reconfigured and expanded its exclusive selection of SMT turnkey packages, including stencil printers, pick and place machines, and reflow ovens, to accommodate a wider range of production levels and budgets. Among the ten different turnkeys presented on their website at www.manncorp.com/turnkeys is the new 2500-MV package. Priced at only $46,995, the 2500-MV is designed for companies with a limited budget and minimal floor space who need short-run, in-house production capability for ultra-precise, high component-mix SMT assembly.

Manncorp

Fine Line Stencil Upgrades Step Stencil Technology

Industry News | 2015-12-04 13:06:33.0

December 3, 2015 – Continuing to invest in the most advanced stencil production technologies, FCT Assembly’s Fine Line Stencil division today announced that it has added a next-generation micro-milling system to its operation to enable production of highly-accurate step -- or multi-level -- stencils.

FCT ASSEMBLY, INC.

Hesse & Knipps To Discuss “Large Diameter Wedge Bonding of Round and Ribbon Wire for Automotive Applications” at IMAPS Advanced Technology Workshop

Industry News | 2012-05-11 20:19:04.0

Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, will discuss "Large Diameter Wedge Bonding of Round and Ribbon Wire for Automotive Applications" during IMAPS 3rd Advanced Technology Workshop and Tabletop Exhibition on Automotive Microelectronics and Packaging, taking place at the Dearborn Hotel in Dearborn, Michigan May 22-24, 2012.

Hesse Mechatronics

Preview for Seica Inc. – Las Vegas, Nevada, IPC Apex March 15-17, 2016, booth # 2310 In the ramp light: Automation and Industry 4.0

Industry News | 2016-02-03 12:04:47.0

The theme for Seica at Apex this year will be automation and Industry 4.0. Highlights will include the traditional Compact line of bed of nails and functional testers; the Pilot line, a truly versatile and multi-faceted flying probe system; its Mini line of benchtop ATE, and the Firefly line, a premier laser selective soldering system.

3M Electrical Solutions Division

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