Industry News | 2012-01-26 23:23:54.0
ASYS Group has announced the release of the EKRA XACT 4 flexible screen and stencil printer. Live demonstrations will be held at IPC APEX 2012.
Industry News | 2012-08-13 14:34:32.0
The Balver Zinn Group announces that Cobar Solder Products Inc. now carries Balver Zinn LF3237 Solder Wire, a heat activated water soluble flux formulation for special applications.
Industry News | 2013-06-06 19:12:21.0
The Balver Zinn Group announces that Cobar Solder Products Inc. will exhibit Balver Zinn water-soluble LF3237 Solder Wire in Booth #44 at the upcoming SMTA Upper Midwest Expo and Tech Forum, scheduled to take place Thursday, June 27, 2013 at the Embassy Suites in Bloomington, MN
Industry News | 2014-10-21 17:17:06.0
Aqueous Technologies announces that registration is open for the fifth and final webinar of its five-part Cleaning and Reliability Live Webinar Series.
Industry News | 2016-05-16 16:16:21.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity.
Industry News | 2016-05-21 07:36:35.0
SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void to optimize manufacturing process performance. The world’s largest IC Packaging and Test Service OSAT utilize SHENMAO Bumping Solder Paste in production.
Industry News | 2016-05-24 20:29:22.0
SHENMAO SMF-WB02 / SMF-WB51 Water Soluble Flux are made locally in the USA and with the same quality in 7 other worldwide locations. It is said their Low Viscosity (easy to apply), High Tackiness (slump resistant), consistent printability for BGA and Micro BGA Ball Assemblies and excellent wash ability after high temperature reflow (255ºC and 60 sec over 220ºC) create highly reliable Solder Joints with optimum maximized Quality.
Industry News | 2019-06-10 22:30:02.0
Climatest Symor launched the new fast dehumidifying dry cabinets,the moisture can lower to
Industry News | 2016-11-18 09:44:39.0
Glass Panel Coating System
Industry News | 2019-11-05 22:17:26.0
Plated half holes（castellated holes）are holes that made off the edge of the boards plated with copper using a specialized process. It is predominantly used for board-on-board connections, mostly where two printed circuit boards with different technologies are combined. Through connecting the PCBs together directly, the whole system is considerably thinner than a comparable connection with multi-pin connectors.The plated edges are also useful in producing mini PCB modules.
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