Industry News | 2013-04-01 09:02:49.0
AIM Solder today announced that it will highlight its new NC259 Solder Paste in Booth #554-556 at the Del Mar Electronics & Design Show (DMEDS), scheduled to take place May 1-2, 2013 at the Del Mar Fairgrounds in San Diego, CA
Industry News | 2014-09-10 18:04:30.0
ADLINK Technology announces the release of its new IMT-1 Android 4.2 tablet, integrating the TI OMAP5432 1.5GHz dual-core ARM A15 processor for high performance computing power. Built-in WLAN or optional WWAN connectivity enables the IMT-1 to easily access information in a wide variety of workplace scenarios.
Industry News | 2017-05-16 18:13:14.0
VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, reports success with the new Summit 1800i. Both long-term Summit customers and new, domestic and international, have placed orders for the enhanced model.
Industry News | 2017-07-18 15:18:44.0
VJ Electronix will exhibit in Stand 1J45 at NEPCON South China, scheduled to take place August 29-31, 2017 at the Shenzhen Convention & Exhibition Center. The company will demonstrate new material handling automation for the XQuik II with AccuCount Technology, along with the new and improved model Summit 1800i.
Industry News | 2019-07-15 14:35:27.0
(Albany, NY) July 15, 2019 YINCAE Advanced Materials is proud to announce that we will be exhibiting at this year’s IMAPS 2019 Boston 52nd International Symposium on Microelectronics, at the Hynes Convention Center, in Boston, MA on October 1 - 2, 2019.
Industry News | 2020-11-13 17:08:31.0
Virtual Industries Inc. is pleased to announce that it is seeing increased interest in the market for its Black Plastic PRO-SERIES PEN-VAC™ Kit (V8910-BK-KIT-ESD). These vacuum pens are ideal for SMT assembly or for handling any parts that have a non-porous surface.
Industry News | 2016-05-16 20:59:04.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 8 worldwide SHENMAO locations.
Industry News | 2016-04-21 19:06:25.0
ADLINK Technology today announced two new solutions based on the Intel® Xeon® Processor E5-2600 Product Family (codename Broadwell-EP). These latest ADLINK offerings are based on 14nm technology-based, server-class Intel® processors that bring intelligence to the edge for IoT applications, and include an AdvancedTCA® processor blade and network appliance from our Modular Industrial Cloud Architecture (MICA) offering. The new products target networking, communications, security and other data center applications where ruggedness is critical and compute requirements are intense.
Industry News | 2021-09-10 10:45:14.0
New Yorker Electronics Releases new Polytron Devices 700-Watt Medical Power Units Delivering High Efficiency to 92-percent
Industry News | 2013-06-06 19:12:21.0
The Balver Zinn Group announces that Cobar Solder Products Inc. will exhibit Balver Zinn water-soluble LF3237 Solder Wire in Booth #44 at the upcoming SMTA Upper Midwest Expo and Tech Forum, scheduled to take place Thursday, June 27, 2013 at the Embassy Suites in Bloomington, MN
