Industry News: 11-12 (Page 10 of 20)

AIM Solder products now available through online leader Stanley Supply & Services

Industry News | 2012-11-12 00:30:12.0

AIM Solder has teamed up with the electronic manufacture supply leader, Stanley Supply and Services, to offer AIM's advanced solder products such as lead-free bar solder, wire solder, solder epoxy, and solder paste through Stanley Supply & Services e-commerce site.

AIM Solder

Kester and Speedline Introduce European Cooperation at Productronica 2007

Industry News | 2007-11-12 20:08:47.0

ITASCA, IL � November 12, 2007 � Kester announces that it has entered into an agreement with Speedline Technologies during the Productronica 2007 exhibition and conference, scheduled to take place November 13-16, 2007 at the Munich Trade Fair Center in Munich, Germany.

Kester

Labtech Microwave Reports On Excellent European Microwave Week Exhibition.

Industry News | 2007-11-12 20:20:42.0

Labtech Microwave, one of the UK's leading manufacturers of microwave component technology has reported a successful European Microwave Exhibition (EuMW) 2007, and in particular noted the shift in profile of potential new customers.

Labtech Microwave

Krayden, Kraydenmex Partner with Henkel as Full Line Henkel Electronics Distributor

Industry News | 2008-11-12 15:02:58.0

DENVER, Colorado � November 2008 � Krayden, Inc. and Kraydenmex, leading distributors of engineered materials, announces that they have partnered with Henkel Corporation as a full line distributor of Henkel's leading electronics materials brands including Loctite� Hysol�, Multicore�, and Emerson & Cuming.

Krayden Inc.

DEK Solar expands global reach with new additions

Industry News | 2008-11-12 16:25:08.0

DEK Solar has announced two new key personnel additions to its dynamic team, expanding the company's capabilities in the fast-growing photovoltaic sector even further. Zhang Jun joins the DEK Solar team in China as Customer Support Engineer, while Jens Katschke takes the role of Business Development Manager to support DEK's solar activities in Western Europe.

ASM Assembly Systems (DEK)

Breakthrough Concept to Bond Circuit Board Jumper Wires

Industry News | 2008-11-12 20:09:45.0

November 10, 2008 - Haverhill, MA � CircuitMedic's Flextac Wire Dots replace glues and adhesives with super-sticky tape specially designed and cut to permanently secure circuit board jumper wires. This unique wire tacking product consisting of pre-cut shapes of a thin, flexible polymer film coated on one side with a high performance, electronics grade permanent pressure sensitive adhesive. Flextac Wire Dots conform to the shape of the wire and the board surface providing a high strength bond to quickly and neatly secure jumper wires.

Circuit Technology Center, Inc.

Krayden Inc. to Highlight Suppliers' Technologies at ATX South 2009

Industry News | 2009-03-02 22:09:34.0

DENVER � March 2009 � Krayden, Inc., a leading distributor of engineered materials and Dow Corning's Distributor of the Year, announces that it will exhibit technologies from its industry-leading suppliers in booth 646 at the upcoming ATX South Exposition & Conference, scheduled to take place March 11-12, 2009 at the Charlotte Convention Center in Charlotte, NC.

Krayden Inc.

Bliss Industries Reduces Prices for the First Time in Company History

Industry News | 2009-05-11 12:03:35.0

MILPITAS, Calif. � May 2009 � Bliss Industries Inc., provider of handling carts and racks for electronics assembly, announces that, for the first time in company history, it has rolled back prices. Bliss has reduced prices on almost all products by up to 30 percent.

Bliss Industries, Inc.

Data I/O’s FlashCORE III Wins a 2009 Global Technology Award

Industry News | 2009-11-11 12:15:12.0

REDMOND, Wash. – November 2009 – Data I/O Corporation (NASDAQ: DAIO), the leading provider of manual and automated device programming solutions, announces that it has been awarded a Global Technology Award in the category of Programming for its FlashCORE III. The award was presented to the company during a Tuesday, November 10, 2009 ceremony that took place at the New Munich Trade Fair Center in Munich, Germany.

Data I/O Corporation


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