Industry News | 2003-03-27 08:15:33.0
Modular Embedded Circuit Board from parvus Enables Local Device Fingerprint Biometrics
Industry News | 2003-05-22 08:14:29.0
RF module reference designs have been developed so that the customer can take the radio design and drop it right into their PCB or build a separate module
Industry News | 2013-08-27 13:14:25.0
Baja Bid, a leading host for online SMT exchange auction events, is kicking off another sale of used SMT, assembly, and remanufactured SMT equipment.
Industry News | 2018-10-18 10:24:05.0
The Design Principles of Stencil Apertures
Industry News | 2013-05-30 23:40:17.0
IPC announced today the April findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Notable among the month’s findings is the PCB book-to-bill ratio, which reached 1.10, its highest level since July 2010.
Industry News | 2020-06-29 15:53:27.0
IPC announced today the May 2020 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.10.
Industry News | 2013-06-28 18:52:56.0
IPC announced today the May findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. The PCB book-to-bill ratio stayed strong for the sixth consecutive month, remaining at 1.10, an indication that recovery from nearly a two-year slump may be starting.
Industry News | 2012-04-03 13:02:23.0
BANNOCKBURN, Ill., USA, April 3, 2012 — IPC — Association Connecting Electronics Industries® announced the Japanese language release of the E revision of IPC-A-610, 電子組立品の許容基準. IPC’s most widely-used standard.
Industry News | 2012-06-06 11:08:43.0
Count On Tools Inc.announces that PB Swiss Tools has introduced the Insider 3 Long Tool. PB Swiss Tools’ Insider combines 10 different screwdrivers into one lightweight, compact tool.
Industry News | 2013-01-30 17:54:43.0
Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.
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