Industry News: 116 (Page 1 of 5)

North American PCB Sales and Orders Continue to Climb IPC Releases PCB Industry Results for January 2018

Industry News | 2018-03-07 07:29:18.0

IPC — Association Connecting Electronics Industries® announced today the January 2018 findings from its North American Printed Circuit Board (PCB) Statistical Program. Both sales and orders were up year-over-year in January. Due to continued strong order growth in January, the book-to-bill ratio climbed to a 12-year high of 1.16.

Association Connecting Electronics Industries (IPC)

IPC RELEASES PCB INDUSTRY RESULTS FOR JUNE 2012

Industry News | 2012-07-26 15:41:05.0

IPC  announced today the June findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.

Association Connecting Electronics Industries (IPC)

North American PCB Business Growth Sags in January but Indicators of Future Growth Remain Positive

Industry News | 2015-03-11 22:41:07.0

IPC announced today the January findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Despite sluggish sales and orders in January, the positive book-to-bill ratios of the past four months indicate sales growth in the first half of 2015.

Association Connecting Electronics Industries (IPC)

North American PCB Sales Enjoyed Solid Growth in December

Industry News | 2017-02-02 13:15:06.0

IPC announced today the December 2016 findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Sales growth in December was solid while the PCB book-to-bill ratio slipped to 0.98.

Association Connecting Electronics Industries (IPC)

IPC RELEASES PCB INDUSTRY RESULTS FOR APRIL 2012

Industry News | 2012-05-25 14:20:09.0

IPC — Association Connecting Electronics Industries® announced today the April findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.

Association Connecting Electronics Industries (IPC)

Engineered Materials Systems Introduces Low-Temperature Cure Conductive Adhesive for Static Drain and EMI/RFI Shielding Applications

Industry News | 2016-02-08 13:34:06.0

Engineered Materials Systems announces the introduction of its new EMS 618-116 Adhesive. The low-temperature cure one-part conductive adhesive has been designed for circuit assembly applications.

EMS International Corporation

SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces PF606-P116 / PF606-P128 / PF606-XP LED Die Bonding Solder Pastes

Industry News | 2016-06-05 13:20:49.0

SHENMAO PF606-P116 Halogen Free Water Soluble LED Die Bonding Solder Pastes are made locally in the USA and with the same quality in 8 other worldwide locations.

Shenmao Technology Inc.

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