Industry News: 12 hardware limit (Page 12 of 99)

Nordson ASYMTEK Introduces New Spectrum II S2-900 Series High Speed, High Accuracy, Precision Dispensing System

Industry News | 2013-11-05 23:02:54.0

Nordson ASYMTEK will introduce the Spectrum™ II at Productronica this year, marking the 6-year anniversary of the introduction of the Spectrum series of high-speed, high-accuracy dispensing platforms. The Spectrum II S2-900 Series leverages the same small footprint of 600mm x 1321mm as the original Spectrum to provide maximum productivity with minimum manufacturing floor space, but improves the precision, accuracy, and speed of the system to rival much larger platforms.

ASYMTEK Products | Nordson Electronics Solutions

IPC Committee Members Honored for Contributions to Electronics Industry and IPC More than 130 Awards Presented at Fall Standards Development Committee Meetings

Industry News | 2013-10-21 16:05:48.0

IPC – Association Connecting Electronics Industries® presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards at IPC’s Fall Standards Development Committee Meetings last week in Fort Worth, Texas.

Association Connecting Electronics Industries (IPC)

Clariant introduces innovative halogen- and cobalt dichloride-free Type 2 Non-reversible Humidity Indicator Cards to ensure integrity of moisture sensitive electronic components

Industry News | 2019-10-22 12:34:34.0

Humitector™ Type 2 delivers advanced sustainable attributes including halogen-free*, cobalt dichloride-free, and reduced cobalt dibromide content The use of Type 2 Humidity Indicator Cards with a non-reversible 60% RH spot indicator is preferred by IPC/JEDEC standard J-STD-033D.

Clariant Cargo & Device Protection

Count On Tools, Inc. Focuses on Its Five Core Precision Component Product Lines at APEX

Industry News | 2024-03-18 12:30:34.0

Count On Tools, Inc. (COT), a leading provider of precision components and SMT spare parts, will exhibit in Booth #1332 at the 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in Calif. The COT team will focus on its core product lines at the show:

Count On Tools, Inc.

Nordson ASYMTEK Introduces Panorama™ Conformal Coating Line Solutions to Fit a Range of Production Processes

Industry News | 2019-10-02 16:32:48.0

Nordson ASYMTEK is pleased to introduce its Panorama™ conformal coating line solutions, providing a balance of equipment and process control for optimal efficiency in automated conformal coating.

ASYMTEK Products | Nordson Electronics Solutions

A Look to the Future in the Electronics Industry at IPC APEX EXPO® 2013

Industry News | 2013-01-19 07:46:16.0

Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics

Association Connecting Electronics Industries (IPC)

SIPLACE at the 2013 APEX show SIPLACE software combined with flexible hardware makes all the difference

Industry News | 2013-01-30 17:37:16.0

After a record year, the SIPLACE team of ASM Assembly Systems wants to keep expanding its market position in North and South America

ASM Assembly Systems GmbH & Co. KG

W. L. Gore & Associates, Inc., Agilent Technologies, and Mitel Agree to Common Standard for 12 Channel Parallel Optic Modules

Industry News | 2001-02-12 09:01:16.0

W. L. Gore & Associates, Agilent Technologies, and Mitel Corporation today announced that they have signed a Multi-Source Agreement (MSA) that will set the industry standard for next-generation parallel fiber optic modules. The three companies have leveraged their wide range of experience in fiber optic and semiconductor technologies to standardize the package and optical and electrical interfaces for their respective modules to ensure that customers will have access to multiple international sources that are compatible with other components within their systems. Each of the companies expects to offer the modules in 2001.

Agilent Technologies, Inc.

Koh Young Shares Revolutionary Advanced Package Inspection Solutions at the SMTA Wafer-Level Packaging Symposium in Burlingame, CA on 12 February 2024

Industry News | 2024-01-29 10:54:17.0

Koh Young Technology will be speaking at the SMTA Wafer-Level Packaging Symposium in Burlingame, California on our Multimodal Phase Shift Optics Approach to revolutionize high-speed 3D reconstruction of semiconductor and advanced packages. In the presentation will highlight how high-speed 3D reconstruction addresses the growing demand for electronic components, which necessitates fast and efficient processing. These advancements in measurement technology and AI integration have paved A machine with a computer on it Description automatically generatedthe way for enhanced packaging applications in the semiconductor industry.

Koh Young America, Inc.


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