Industry News | 2021-05-04 11:12:30.0
The SMTA is pleased to announce the International Conference for Electronics Hardware Enabling Technologies (ICEHET) is scheduled 2-3 June 2021 as an express virtual event.
Industry News | 2019-10-15 14:59:59.0
Nordson ASYMTEK introduces Qadence™, a closed-loop system that automatically compensates for viscosity changes during conformal coating. This innovative system combines the capabilities of Nordson ASYMTEK's conformal coating hardware and software to selectively apply coating to specific areas of a circuit board consistently throughout production. The Qadence flow control system maintains stable fluid application, flow rates, and performance by automatically compensating for viscosity changes related to temperature, humidity, and batch-to-batch variation. It eliminates the need for frequent operator adjustments and downtime to recalibrate the process.
Industry News | 2009-07-09 12:26:58.0
Edward A. Morris, Lockheed Martin Corporation will present "Managing a Perfect Storm: Pb-Free Electronics Risks"
Industry News | 2002-03-27 09:42:31.0
Glenn Woodhouse and Janet Semmens were named winners of the Best of Conference Awards
Industry News | 2014-11-12 13:44:46.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference scheduled to take place November 18-20, 2014 at the Chicago Marriott in Schaumburg, IL. The conference intensely focuses on best practices and new innovative technologies for meeting today’s manufacturing challenges and producing reliable hardware. Doug Pauls of Rockwell Collins will chair Session #7 “Conformal Coating Process Control.”
Industry News | 2021-05-25 12:56:56.0
The SMTA Officer team is excited to provide our members with a free technical webinar on "The Relationship Between Cleanliness and Reliability/Durability" by Debbie Carboni, Global Product Manager at KYZEN Corporation. The presentation will take place on June 10th at 11:00am EST and include:
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2011-07-20 14:49:09.0
The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 8th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 3-6, 2011 at the Santa Clara Marriott Hotel in Santa Clara, California
Industry News | 2010-10-14 16:14:25.0
Count On Tools Inc., a leading provider of precision components and SMT spare parts, announces a one-time limited offer on its Stainless Steel – Fuji Long Life CP-6 Nozzles. The nozzles are regularly $12.25 each and are on sale for $7.50 each or $250 for a pack of 50.
Industry News | 2016-09-11 12:12:28.0
SMTA China announces that it presented awards for seven papers at the SMTA China 10th Anniversary Reception, held on Tuesday, August 30, 2016 at Shenzhen Convention & Exhibition Center in conjunction with the NEPCON South China Show.
